C23C 18/1664
With additional means during the plating process
Official title: {with additional means during the plating process}
C23C18/1664 (With additional means during the plating process) appears on 196 US grants and 239 published applications in this corpus.
Search patents in C23C- Granted patents
- 196
- Published applications
- 239
- Assignees
- 174
- Inventors
- 654
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 4 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 3 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 4 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 4 | 0 |
| 2001 | 3 | 1 |
| 2002 | 3 | 7 |
| 2003 | 6 | 7 |
| 2004 | 9 | 17 |
| 2005 | 1 | 9 |
| 2006 | 5 | 3 |
| 2007 | 4 | 7 |
| 2008 | 5 | 12 |
| 2009 | 4 | 5 |
| 2010 | 2 | 13 |
| 2011 | 9 | 8 |
| 2012 | 8 | 9 |
| 2013 | 3 | 15 |
| 2014 | 9 | 13 |
| 2015 | 7 | 14 |
| 2016 | 6 | 19 |
| 2017 | 17 | 13 |
| 2018 | 8 | 10 |
| 2019 | 6 | 10 |
| 2020 | 8 | 14 |
| 2021 | 11 | 9 |
| 2022 | 7 | 7 |
| 2023 | 7 | 5 |
| 2024 | 1 | 2 |
| 2025 | 7 | 5 |
| 2026 | 3 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for forming electroless plating electrode through selective cross-linking layer formation using laser6 Oct 2026US 12,753,514 B2Andong National University Industry-Academic Cooperation Foundation
- High-temperature resistant nano-copper produced by laser direct writing, preparation method and application thereof21 Jul 2026US 12,686,924 B2Zhejiang University
- Plating apparatus and substrate cleaning method21 Apr 2026US 12,606,929 B2Ebara Corporation
- Apparatus for manufacturing display apparatus and method of manufacturing display apparatus23 Dec 2025US 12,507,583 B2Samsung Display Co., Ltd.
- Electroless plating systems and methods18 Nov 2025US 12,473,650 B1The Boeing Company
- Plating apparatus and substrate cleaning method23 Jul 2026US 2026/0209984 A1Ebara Corporation
- Wet processing device with gas-liquid mixing11 Jun 2026US 2026/0159955 A1Yield Engineering Systems, Inc.
- Phosphorus free electroless palladium23 Apr 2026US 2026/0110094 A1
- Apparatus for manufacturing display apparatus and method of manufacturing display apparatus29 Jan 2026US 2026/0033229 A1Samsung Display Co., Ltd.
- Anode current collector and preparation method therefor, battery cell, battery, and electric device8 Jan 2026US 2026/0011747 A1Contemporary Amperex Technology Co., Limited
Most cited
By later US patents
- Seed layer deposition558US 6,824,665 B2Shipley Company, L.L.C. · 2004
- Plating cell with horizontal product load mechanism314US 5,932,077 AReynolds Tech Fabricators, Inc. · 1999
- Electroless metal deposition of electronic components in an enclosable vessel270US 6,165,912 ACFMT, Inc. · 2000
- Clamshell apparatus for electrochemically treating wafers141US 6,800,187 B1Novellus Systems, Inc. · 2004
- Method and apparatus for controlling plating over a face of a substrate85US 6,090,261 AFormFactor, Inc. · 2000