Method and apparatus for controlling plating over a face of a substrate
AssigneeFormFactor, Inc.
InventorGaetan L. Mathieu
Life of this patent
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Abstract
According to aspect of the invention, a plating system is provided which includes a tank for containing a plating solution, a shaft extending into the tank, and a substrate holder mounted to the shaft. The shaft and the tank are rotatable relative to one another. The substrate holder is configured to support a substrate in position so that at least a first face of the substrate is exposed to the plating solution in the tank.
Claims25
A method of plating on a substrate, the method including:
- exposing a first face of the substrate to a plating solution;
- directing the plating solution onto a first region of the first face of the substrate, the plating solution flowing over the first region, from where the plating solution flows over a second region of the first face, wherein the direction of flow of the plating solution over the first face of the substrate in the second region is changed with respect to the direction of flow of the plating solution over the first face of the substrate in the first region;
- and
- plating on the substrate utilizing a technique selected from the group consisting of electroplating and electroless plating.
A method of rigidifying a plurality of elongate components, each elongate component having an end which is connected to a first face of a substrate, the method including:
- exposing the elongate components to a plating solution;
- and
- directing the plating solution onto a first region of the first face of the substrate and over some of the elongate components at the first region, from where the plating solution flows over a second region of the first face and over some of the elongate components at the second region, wherein the direction of flow of the plating solution over the first face of the substrate in the second region is changed with respect to the direction of flow of the plating solution over the first face of the substrate in the first region;
- and
- plating a layer on each elongate component utilizing the plating solution, wherein the respective layer rigidifies a respect elongate component.
A method of rigidifying a plurality of elongate components, each elongate component having an end which is connected to a first face of a substrate, the method including:
- exposing the elongate components to a plating solution;
- directing the plating solution onto a first region of the first face and over some of the elongate components at the first region, from where the plating solution flows over a second region of the first face and over some of the elongate components at the second region;
- rotating the substrate relative to the plating solution;
- and
- plating a layer substantially on each elongate component utilizng the plating solution, wherein the respective layer rigidifies a respective elongate component.
Dependencies are inferred from the claim text.