C23C 18/1671
Electric field
Official title: {Electric field}
C23C18/1671 (Electric field) appears on 22 US grants and 26 published applications in this corpus.
Search patents in C23C- Granted patents
- 22
- Published applications
- 26
- Assignees
- 29
- Inventors
- 91
- Latest grant
- 18 Feb 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 0 | 1 |
| 2004 | 1 | 2 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 2 | 2 |
| 2008 | 0 | 2 |
| 2009 | 1 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 0 |
| 2012 | 1 | 1 |
| 2013 | 0 | 2 |
| 2014 | 1 | 2 |
| 2015 | 1 | 1 |
| 2016 | 0 | 3 |
| 2017 | 1 | 2 |
| 2018 | 1 | 0 |
| 2019 | 1 | 1 |
| 2020 | 0 | 4 |
| 2021 | 2 | 0 |
| 2022 | 2 | 1 |
| 2023 | 1 | 0 |
| 2024 | 0 | 0 |
| 2025 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Magnesium-containing electrode, method for fabricating the same, and electrochemical device18 Feb 2025US 12,230,785 B2Murata Manufacturing Co., Ltd.
- Method for metal layer formation5 Sep 2023US 11,746,421 B2OrelTech Ltd.
- Metal-plated carbon material and manufacturing method thereof8 Mar 2022US 11,268,194 B2Yazaki Corporation
- Plating method, bubble ejection member, plating apparatus, and device8 Feb 2022US 11,242,610 B2Kyushu University, National University Corporation
- Electroless plating activation31 Aug 2021US 11,109,493 B2Hutchinson Technology Incorporated
- Magnesium-containing electrode, method for fabricating the same, and electrochemical device3 Feb 2022US 2022/0037641 A1Murata Manufacturing Co., Ltd.
- Metal-plated carbon material and manufacturing method thereof1 Oct 2020US 2020/0308705 A1Yazaki Corporation
- Plating method, bubble ejection member, plating apparatus, and device30 Jul 2020US 2020/0240031 A1Kyushu University, National University Corporation
- Apparatus and method for manufacturing continuous reactor type core-shell catalyst electrode28 May 2020US 2020/0168914 A1Korea Institute of Energy Research
- Method for metal layer formation16 Jan 2020US 2020/0017974 A1OrelTech Ltd.
Most cited
By later US patents
- Seed layer deposition558US 6,824,665 B2Shipley Company, L.L.C. · 2004
- Electric field initiated electroless metal deposition23US 5,660,706 ASematech, Inc. · 1997
- Process for the manufacture of abrasive-coated tools19US 4,381,227 ANorton Company · 1983
- Method of partially metallizing electrically conductive non-metallic patterns12US 4,478,690 AU. S. Philips Corporation · 1984
- Passivation of metallic equipment surfaces in electroless copper deposition processes9US 4,391,841 AKollmorgen Technologies Corporation · 1983