Method of partially metallizing electrically conductive non-metallic patterns
AssigneeU.S. Philips Corporation
InventorEltjo Scholtens
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Abstract
The partial metallization of electrically conductive non-metallic patterns, for example transparent patterns of indium oxide and/or tin oxide or resistance layers of cermet material, on insulating carriers by means of an electroless plating solution. The plating is initiated by applying a potential difference for a short period of time between the patterns and an auxiliary electrode.
Claims4
A method of partially metallising electrically conductive non-metallic patterns on insulating substrates, characterized in that the part of the pattern to be metallised is immersed in an electroless plating solution and a potential difference is applied for a short period of time between the pattern and the solution so as to initiate the metal deposition.
Dependencies are inferred from the claim text.