Plating method, bubble ejection member, plating apparatus, and device

A plating method performed on a plating target using a plating solution and a bubble ejection member,

• wherein the bubble ejection member includes:
• an electrode formed of a conductive material;
• and
• an insulating member covering at least a part of the electrode, and
• at least a part of the insulating member forms a bubble ejection port, and an air gap surrounded by the insulating member is formed between at least a part of the electrode and the bubble ejection port,
• the plating method comprising at least:
• supplying the plating solution to a target portion of the plating target to be plated;
• ejecting a bubble generated by the bubble ejection member from the bubble ejection port to the plating solution on the plating target;
• and
• performing plating the target portion of the plating target,
• wherein the ejecting the bubble comprises applying a voltage between the electrode and a counter electrode, and
• the counter electrode is a member different from the plating target and placed at a location other than the air gap of the bubble ejection member.