C23C 18/1666
Ultrasonics
Official title: {Ultrasonics}
C23C18/1666 (Ultrasonics) appears on 30 US grants and 32 published applications in this corpus.
Search patents in C23C- Granted patents
- 30
- Published applications
- 32
- Assignees
- 36
- Inventors
- 122
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 1 |
| 2003 | 2 | 3 |
| 2004 | 2 | 1 |
| 2005 | 0 | 2 |
| 2006 | 2 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 1 |
| 2009 | 0 | 1 |
| 2010 | 1 | 1 |
| 2011 | 2 | 0 |
| 2012 | 1 | 0 |
| 2013 | 0 | 2 |
| 2014 | 1 | 0 |
| 2015 | 1 | 1 |
| 2016 | 0 | 2 |
| 2017 | 1 | 1 |
| 2018 | 1 | 2 |
| 2019 | 0 | 3 |
| 2020 | 1 | 3 |
| 2021 | 4 | 2 |
| 2022 | 1 | 1 |
| 2023 | 2 | 0 |
| 2024 | 0 | 1 |
| 2025 | 0 | 2 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for forming electroless plating electrode through selective cross-linking layer formation using laser6 Oct 2026US 12,753,514 B2Andong National University Industry-Academic Cooperation Foundation
- Method for forming nickel plated graphene hollow sphere1 Aug 2023US 11,713,510 B2Beijing Institute of Technology
- Methods of preparing articles by electrodeposition and additive manufacturing processes24 Jan 2023US 11,560,629 B2Modumetal, Inc.
- Nickel-coated hexagonal boron nitride nanosheet composite powder, preparation and high performance composite ceramic cutting tool material3 May 2022US 11,319,251 B2Qilu University of Technology
- Semiconductor apparatus having through silicon via structure and manufacturing method thereof28 Sep 2021US 11,133,218 B1
- Anode current collector and preparation method therefor, battery cell, battery, and electric device8 Jan 2026US 2026/0011747 A1Contemporary Amperex Technology Co., Limited
- Method for forming electroless plating electrode through selective cross-linking layer formation using laser17 Jul 2025US 2025/0230549 A1Andong National University Industry-Academic Cooperation Foundation
- Method of metallization with a nickel or cobalt alloy for the manufacture of semiconductor devices1 May 2025US 2025/0137140 A1MacDermid Enthone Inc.
- Metal nanowire foam12 Sep 2024US 2024/0304355 A1Monash University
- Method of fabricating and coating copper nanowires24 Feb 2022US 2022/0056587 A1Portland State University
Most cited
By later US patents
- Plating cell with horizontal product load mechanism314US 5,932,077 AReynolds Tech Fabricators, Inc. · 1999
- Electroless metal deposition of electronic components in an enclosable vessel270US 6,165,912 ACFMT, Inc. · 2000
- Process for whisker-free aqueous electroless tin plating36US 6,361,823 B1Atotech Deutschland GmbH · 2002
- Nanotube growth and device formation28US 7,964,174 B2Intel Corporation · 2011
- Processes for fabricating conductive patterns using nanolithography as a patterning tool27US 7,005,378 B2NanoInk, Inc. · 2006