Method of metallization with a nickel or cobalt alloy for the manufacture of semiconductor devices

A process for metallizing a mineral oxide substrate with a nickel-boron or cobalt-boron alloy, said metallization process comprising:

• a) activating one or more surfaces of the mineral oxide substrate with a noble metal, wherein the activation step comprises:
• i. a first activation stage comprising the step of activating the surface of the mineral oxide substrate by contacting the surface of the mineral oxide substrate with a first activation solution, the first activation solution comprising a solvent, a noble metal complex with a complexing agent, and an organo-silane bi-functional binder, and thereafter
• ii. a second activation stage comprising the step of activating the surface of the mineral oxide substrate by contacting the surface of the mineral oxide substrate with a second activation solution, the second activation solution comprising an aqueous solution of acidic pH comprising noble metal ions;
• and
• b) contacting the one or more surfaces of the mineral oxide substrate, in the absence of electrical polarization, with an electroless aqueous solution comprising one or more of nickel ions and cobalt ions and a reducing agent comprising boron, to form a nickel-boron or cobalt-boron alloy layer on the surface of the mineral oxide substrate.