C23C 18/1669
Agitation
Official title: {Agitation, e.g. air introduction}
C23C18/1669 (Agitation) appears on 80 US grants and 81 published applications in this corpus.
Search patents in C23C- Granted patents
- 80
- Published applications
- 81
- Assignees
- 67
- Inventors
- 254
- Latest grant
- 21 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 4 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 1 | 1 |
| 2002 | 2 | 4 |
| 2003 | 2 | 2 |
| 2004 | 7 | 12 |
| 2005 | 1 | 5 |
| 2006 | 1 | 3 |
| 2007 | 3 | 1 |
| 2008 | 4 | 4 |
| 2009 | 2 | 0 |
| 2010 | 0 | 2 |
| 2011 | 3 | 0 |
| 2012 | 2 | 2 |
| 2013 | 0 | 5 |
| 2014 | 2 | 5 |
| 2015 | 0 | 6 |
| 2016 | 3 | 5 |
| 2017 | 7 | 4 |
| 2018 | 2 | 1 |
| 2019 | 1 | 1 |
| 2020 | 3 | 5 |
| 2021 | 0 | 4 |
| 2022 | 3 | 2 |
| 2023 | 2 | 2 |
| 2024 | 1 | 1 |
| 2025 | 4 | 2 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Plating apparatus and substrate cleaning method21 Apr 2026US 12,606,929 B2Ebara Corporation
- Electroless plating systems and methods18 Nov 2025US 12,473,650 B1The Boeing Company
- Agitation monitoring system for plating process26 Aug 2025US 12,399,006 B2Intel Corporation
- Distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate8 Jul 2025US 12,351,935 B2Semsysco GmbH
- Apparatus for electroless metallization of a target surface of at least one workpiece, and method and diffuser plate for this purpose11 Mar 2025US 12,247,292 B2Ap & S International GmbH
- Plating apparatus and substrate cleaning method23 Jul 2026US 2026/0209984 A1Ebara Corporation
- Wet processing device with gas-liquid mixing11 Jun 2026US 2026/0159955 A1Yield Engineering Systems, Inc.
- Plating apparatus and substrate cleaning method6 Mar 2025US 2025/0075363 A1Ebara Corporation
- Dual channel flow plate for wet processing30 Jan 2025US 2025/0038013 A1Yield Engineering Systems, Inc.
- Distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate2 May 2024US 2024/0141534 A1Semsysco GmbH
Most cited
By later US patents
- Plating cell with horizontal product load mechanism314US 5,932,077 AReynolds Tech Fabricators, Inc. · 1999
- Clamshell apparatus for electrochemically treating wafers141US 6,800,187 B1Novellus Systems, Inc. · 2004
- Method and apparatus for controlling plating over a face of a substrate85US 6,090,261 AFormFactor, Inc. · 2000
- Electroless copper deposition method for preparing copper seed layers41US 6,664,122 B1Novellus Systems, Inc. · 2003
- Method for concomitant particulate diamond deposition in electroless plating, and the product thereof37US 3,936,577 AE. I. Du Pont de Nemours and Company · 1976