C23C 18/1678
Heating of the substrate
Official title: {Heating of the substrate}
C23C18/1678 (Heating of the substrate) appears on 55 US grants and 85 published applications in this corpus.
Search patents in C23C- Granted patents
- 55
- Published applications
- 85
- Assignees
- 41
- Inventors
- 209
- Latest grant
- 2 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 3 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 0 | 1 |
| 2002 | 0 | 3 |
| 2003 | 1 | 5 |
| 2004 | 2 | 11 |
| 2005 | 3 | 6 |
| 2006 | 3 | 8 |
| 2007 | 1 | 2 |
| 2008 | 3 | 6 |
| 2009 | 3 | 5 |
| 2010 | 3 | 6 |
| 2011 | 2 | 6 |
| 2012 | 2 | 1 |
| 2013 | 4 | 1 |
| 2014 | 3 | 1 |
| 2015 | 1 | 4 |
| 2016 | 4 | 2 |
| 2017 | 1 | 2 |
| 2018 | 3 | 2 |
| 2019 | 0 | 1 |
| 2020 | 2 | 3 |
| 2021 | 0 | 1 |
| 2022 | 2 | 4 |
| 2023 | 0 | 2 |
| 2024 | 1 | 1 |
| 2025 | 4 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Substrate processing apparatus and substrate processing method2 Sep 2025US 12,404,587 B2Tokyo Electron Limited
- Substrate processing method5 Aug 2025US 12,378,670 B2Tokyo Electron Limited
- Substrate processing apparatus and substrate processing method15 Apr 2025US 12,276,027 B2Tokyo Electron Limited
- Copper based conductive ink composition and method of making the same7 Jan 2025US 12,187,909 B2Electroninks Incorporated
- Substrate processing apparatus, substrate processing method and recording medium20 Feb 2024US 11,905,597 B2Tokyo Electron Limited
- System and method for performing localized electroless nickel plating13 Feb 2025US 2025/0051926 A1Nuovo Pignone Tecnologie Srl
- Substrate processing method2 May 2024US 2024/0141501 A1Tokyo Electron Limited
- Copper based conductive ink composition and method of making the same3 Aug 2023US 2023/0242783 A1Electroninks Incorporated
- Substrate processing apparatus and substrate processing method30 Mar 2023US 2023/0098105 A1Tokyo Electron Limited
- Substrate processing method and substrate processing apparatus11 Aug 2022US 2022/0251709 A1Tokyo Electron Limited
Most cited
By later US patents
- Measurement techniques for controlling aspects of a electroless deposition process232US 7,465,358 B2APPLIED Materials.Inc. · 2008
- Apparatus for electroless deposition227US 7,341,633 B2APPLIED Materials.Inc. · 2008
- Apparatus for controlling plating over a face of a substrate120US 6,042,712 AFormFactor, Inc. · 2000
- Method and apparatus for controlling plating over a face of a substrate85US 6,090,261 AFormFactor, Inc. · 2000
- Process for electrochemical metallization of dielectrics47US 4,576,689 A1986