C23C 18/1685
With supercritical condition
Official title: {with supercritical condition, e.g. chemical fluid deposition}
C23C18/1685 (With supercritical condition) appears on 14 US grants and 21 published applications in this corpus.
Search patents in C23C- Granted patents
- 14
- Published applications
- 21
- Assignees
- 17
- Inventors
- 61
- Latest grant
- 2 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 1 |
| 2004 | 1 | 1 |
| 2005 | 2 | 0 |
| 2006 | 0 | 3 |
| 2007 | 0 | 1 |
| 2008 | 0 | 1 |
| 2009 | 0 | 1 |
| 2010 | 1 | 3 |
| 2011 | 0 | 2 |
| 2012 | 0 | 0 |
| 2013 | 1 | 0 |
| 2014 | 1 | 1 |
| 2015 | 0 | 1 |
| 2016 | 1 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 1 |
| 2020 | 0 | 1 |
| 2021 | 0 | 0 |
| 2022 | 1 | 2 |
| 2023 | 0 | 0 |
| 2024 | 2 | 2 |
| 2025 | 1 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of fabricating semiconductor device using apparatus for supplying supercritical fluids2 Jun 2026US 12,644,188 B2Samsung Electronics Co., Ltd.
- Substrate treating apparatus and filler member provided therein25 Feb 2025US 12,234,555 B2Semes Co., Ltd.
- Method of enhancing corrosion resistance of oxidizable materials and components made therefrom12 Nov 2024US 12,139,794 B2Purdue Research Foundation
- Apparatus for fabricating semiconductor device having upper and lower inlets for supplying supercritical fluids and method of fabricating semiconductor device using the same8 Oct 2024US 12,110,593 B2Samsung Electronics Co., Ltd.
- Metal-plated carbon material and manufacturing method thereof8 Mar 2022US 11,268,194 B2Yazaki Corporation
- Apparatus for fabricating semiconductor device having upper and lower inlets for supplying supercritical fluids and method of fabricating semiconductor device using the same26 Dec 2024US 2024/0425988 A1Samsung Electronics Co., Ltd.
- Apparatus and method for processing substrate using supercritical fluid6 Jun 2024US 2024/0183037 A1Semes Co., Ltd.
- Substrate treating apparatus and filler member provided therein16 Jun 2022US 2022/0186379 A1Semes Co., Ltd.
- Apparatus for fabricating semiconductor device and method of fabricating semiconductor device using the same5 May 2022US 2022/0136111 A1Samsung Electronics Co., Ltd.
- Metal-plated carbon material and manufacturing method thereof1 Oct 2020US 2020/0308705 A1Yazaki Corporation
Most cited
By later US patents
- Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating process241US 6,616,967 B1Texas Instruments Incorporated · 2003
- Method and apparatus for introduction of solid precursors and reactants into a supercritical fluid reactor11US 6,951,765 B1Novellus Systems, Inc. · 2005
- Electrochemical treating method such as electroplating and electrochemical reaction device therefor6US 6,793,793 B22004
- Method and apparatus for plating a substrate3US 6,123,984 AEbara Corporation · 2000
- Apparatus for fabricating semiconductor device having upper and lower inlets for supplying supercritical fluids and method of fabricating semiconductor device using the same1US 12,110,593 B2Samsung Electronics Co., Ltd. · 2024