Substrate treating apparatus and filler member provided therein

A filler member for filling part of a volume of a process space in a substrate treating apparatus including a vessel configured to provide the sealed process space, a supply port configured to supply a process fluid into the process space, and an exhaust port configured to evacuate an atmosphere in the process space, the filler member comprising:

• a plate member disposed under a substrate, the plate member having a predetermined thickness;
• and
• a buffer member provided under the plate member and spaced apart from the plate member,
• wherein the buffer member includes:
• a sidewall portion located outward of the supply port and the exhaust port and configured to make contact with a wall of the vessel;
• and
• an upper wall portion having a through-hole formed therein to correspond to a center of the plate member, wherein the through-hole forms a straight flow path in an up/down direction.

An apparatus for treating a substrate, the apparatus comprising:

• a vessel having a sealable process space formed therein in which the substrate is accommodated;
• a supply port provided inside a wall of the vessel and configured to supply a process fluid into the process space;
• an exhaust port provided inside the wall of the vessel and spaced apart from the supply port;
• and
• a filler member configured to fill part of a volume of the process space,
• wherein a first bottom surface configured to define the process space is formed in the vessel,
• wherein a cylindrical recess is formed to a predetermined depth on the first bottom surface, and a second bottom surface is defined by the recess,
• wherein the supply port and the exhaust port are provided in an area of the second bottom surface,
• wherein the filler member includes:
• a plate member disposed under the substrate, the plate member having a predetermined thickness;
• and
• a buffer member provided under the plate member and spaced apart from the plate member, the buffer member being provided in a position overlapping with the supply port and the exhaust port when viewed from above, and
• wherein the buffer member includes:
• a sidewall portion placed on the second bottom surface and located outward of the supply port and the exhaust port, the sidewall portion being configured to make contact with the wall of the vessel;
• an upper wall portion having a through-hole formed therein to correspond to a center of the substrate, wherein the through-hole forms a straight flow path in an up/down direction, and an upper surface of the upper wall portion is provided in a position parallel to the first bottom surface;
• and
• an inner wall portion extending downward from the upper wall portion to increase a length of the flow path of the through-hole.