Apparatus for fabricating semiconductor device and method of fabricating semiconductor device using the same

An apparatus for fabricating a semiconductor device, the apparatus comprising:

• a chamber configured to accommodate a substrate coated with a first fluid;
• a lower inlet which is placed in a lower wall of the chamber and configured to provide a first supercritical fluid into the chamber;
• an upper inlet placed in an upper wall of the chamber and configured to provide a second supercritical fluid into the chamber;
• a fluid outlet placed in the lower wall of the chamber and configured to discharge a second fluid which is a mixture of the first fluid and the first supercritical fluid to outside of the chamber;
• and
• a drain cup placed between the lower wall of the chamber and the substrate, and having a first portion of which a width, in a horizontal direction, decreases toward the lower wall of the chamber, and a second portion which connects the first portion and the fluid outlet to each other.

An apparatus for fabricating a semiconductor device, the apparatus comprising:

• a chamber configured to accommodate a substrate coated with a first fluid and including a first region and a second region;
• a drain cup which is placed between a lower wall of the chamber and the substrate, the drain cup including:
• a first portion of which a width, in a horizontal direction, decreases toward the lower wall of the chamber, and
• a second portion which connects the first portion to the lower wall of the chamber, and separates the first region and the second region;
• a lower inlet which is placed in the lower wall of the chamber and is configured to provide a first supercritical fluid into the chamber;
• and
• an upper inlet which is placed in an upper wall of the chamber, and is configured to provide a second supercritical fluid into the chamber,
• wherein the first region is a region between the drain cup and an inner wall of the chamber, and the second region is a region surrounded by the drain cup.