Method and apparatus for plating a substrate
AssigneeEbara Corporation
InventorKuriyama Fumio
Life of this patent
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Abstract
A method and apparatus can produce a sound metal deposit inside fine cavities fabricated on a substrate such as a semiconductor wafer through pre-plating treatment process for smoothly filling the fine cavities with plating solution. The method comprises disposing the substrate in a hermetic chamber, filling the chamber with a treatment medium which is liquid at normal temperature and pressure, maintaining the treatment medium within the chamber at a subcritical or supercritical state. The treatment medium within the chamber is finally converted into liquid phase without passing through a vapor phase by controlling pressure and temperature within the chamber so as to infiltrate the treatment medium into the fine cavities.
Claims10
A method for producing a metal deposit inside fine cavities fabricated on a substrate, said method comprising:
- disposing said substrate in a hermetic chamber;
- filling said chamber with a treatment medium which is liquid at normal temperature and pressure;
- maintaining said treatment medium within said chamber at a subcritical or supercritical state;
- converting said treatment medium within said chamber into liquid phase without passing through a vapor phase by controlling pressure and temperature within said chamber so as to infiltrate said liquid-phase treatment medium into said fine cavities, wherein said maintaining and converting operations are performed in a sequential manner;
- and
- plating said substrate to produce a metal deposit inside said fine cavities.
A method for fabricating wiring by producing a metal deposit inside fine cavities fabricated on a substrate, said method comprising:
- disposing said substrate in a hermetic chamber;
- introducing a treatment medium which is liquid at normal temperature and pressure into said chamber;
- maintaining said treatment medium within said chamber at a subcritical or supercritical state;
- converting said treatment medium within said chamber to liquid phase without passing through a vapor phase by controlling pressure and temperature within said chamber so as to infiltrate said treatment medium into said fine cavities;
- plating said substrate to produce a metal deposit inside said fine cavities;
- and
- removing unwanted metallic regions deposited on said substrate by chemical mechanical polishing.
Dependencies are inferred from the claim text.