C23C 18/1682
Control of atmosphere
Official title: {Control of atmosphere}
C23C18/1682 (Control of atmosphere) appears on 54 US grants and 76 published applications in this corpus.
Search patents in C23C- Granted patents
- 54
- Published applications
- 76
- Assignees
- 51
- Inventors
- 211
- Latest grant
- 30 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 1 |
| 2002 | 0 | 0 |
| 2003 | 1 | 2 |
| 2004 | 0 | 2 |
| 2005 | 2 | 5 |
| 2006 | 1 | 8 |
| 2007 | 0 | 2 |
| 2008 | 2 | 1 |
| 2009 | 1 | 3 |
| 2010 | 2 | 7 |
| 2011 | 4 | 7 |
| 2012 | 3 | 2 |
| 2013 | 2 | 1 |
| 2014 | 2 | 8 |
| 2015 | 2 | 2 |
| 2016 | 5 | 4 |
| 2017 | 2 | 1 |
| 2018 | 2 | 3 |
| 2019 | 0 | 4 |
| 2020 | 2 | 2 |
| 2021 | 1 | 2 |
| 2022 | 3 | 6 |
| 2023 | 4 | 2 |
| 2024 | 1 | 0 |
| 2025 | 2 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Metal material and method for manufacturing metal material30 Sep 2025US 12,428,732 B2Sumitomo Electric Industries, Ltd.
- Plated substrate13 May 2025US 12,297,542 B2Murata Manufacturing Co., Ltd.
- Method and device for plating a recess in a substrate20 Feb 2024US 11,908,698 B2Semsysco GmbH
- Methods and systems for electroless plating a first metal onto a second metal in a molten salt bath, and surface pretreatments therefore5 Dec 2023US 11,834,746 B2Consolidated Nuclear Security, LLC
- Manufacturing enhanced graphite metallic bipolar plate materials21 Nov 2023US 11,824,229 B2NEXGEN Materials, LLC
- Dual channel flow plate for wet processing30 Jan 2025US 2025/0038013 A1Yield Engineering Systems, Inc.
- Metal material and method for manufacturing metal material23 Mar 2023US 2023/0090510 A1Sumitomo Electric Industries, Ltd.
- Methods and systems for electroless plating a first metal onto a second metal in a molten salt bath, and surface pretreatments therefore9 Feb 2023US 2023/0044020 A1Consolidated Nuclear Security, LLC
- Plated substrate22 Dec 2022US 2022/0403524 A1Murata Manufacturing Co., Ltd.
- Substrate liquid processing method and substrate liquid processing apparatus22 Dec 2022US 2022/0406605 A1Tokyo Electron Limited
Most cited
By later US patents
- Electroless deposition of metal films with spray processor361US 6,065,424 ACornell Research Foundation, Inc. · 2000
- Measurement techniques for controlling aspects of a electroless deposition process232US 7,465,358 B2APPLIED Materials.Inc. · 2008
- Apparatus for electroless deposition227US 7,341,633 B2APPLIED Materials.Inc. · 2008
- Apparatus and method for electroless deposition of materials on semiconductor substrates35US 6,913,651 B2Blue29, LLC · 2005
- Method for forming a seed layer for the deposition of a metal on a substrate16US 9,093,381 B2Centre National De La Recherche Scientifique · 2015