Plated substrate
AssigneesShibaura Institute of Technology, Murata Manufacturing Co., Ltd.
InventorsTomoji Ohishi, Yasushi Yoshida, Katsuro Hirayama
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Abstract
A modified resin base material that includes a resin material having a base at a surface thereof, and a plating catalytic metal on the surface of the resin material, wherein a combination of the plating catalytic metal and the base is at least one of the following Lewis acid-base combinations according to a HSAB principle: a hard acid and a hard base or an intermediate base, an intermediate acid and a hard base, an intermediate base or a soft base, or a soft acid and an intermediate base or a soft base.
Claims4
A plated substrate comprising:
- a modified resin base material comprising a resin material having a base at a surface thereof, and a plating catalytic metal on the surface of the resin material, wherein the base is —NH2, and the plating catalytic metal is Cu2+ a combination of the plating catalytic metal and the base is at least;
- and
- a plating layer on the modified resin base material wherein the resin material is a fluororesin and the plating layer is a copper plating layer.
A method for forming a plated substrate, the method comprising:
- introducing a base to a surface of a resin material;
- bringing a metal ion into contact with the surface to which the base has been introduced to introduce a plating catalytic metal thereto;
- and
- forming a plating layer by electroless plating on the resin material to which the base and the plating catalytic metal have been introduced, wherein
- the base is —NH2, and the plating catalytic metal is Cu2+, wherein the resin base material is a fluororesin and the plating layer is a copper plating layer.
Dependencies are inferred from the claim text.