C23C 18/1676
Heating of the solution
Official title: {Heating of the solution}
C23C18/1676 (Heating of the solution) appears on 72 US grants and 107 published applications in this corpus.
Search patents in C23C- Granted patents
- 72
- Published applications
- 107
- Assignees
- 72
- Inventors
- 274
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 1 | 5 |
| 2004 | 5 | 10 |
| 2005 | 4 | 9 |
| 2006 | 1 | 4 |
| 2007 | 4 | 5 |
| 2008 | 1 | 2 |
| 2009 | 1 | 4 |
| 2010 | 2 | 4 |
| 2011 | 0 | 3 |
| 2012 | 5 | 1 |
| 2013 | 0 | 6 |
| 2014 | 2 | 5 |
| 2015 | 2 | 11 |
| 2016 | 3 | 4 |
| 2017 | 6 | 6 |
| 2018 | 7 | 3 |
| 2019 | 2 | 0 |
| 2020 | 2 | 3 |
| 2021 | 1 | 3 |
| 2022 | 4 | 5 |
| 2023 | 1 | 5 |
| 2024 | 2 | 5 |
| 2025 | 5 | 3 |
| 2026 | 2 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for forming electroless plating electrode through selective cross-linking layer formation using laser6 Oct 2026US 12,753,514 B2Andong National University Industry-Academic Cooperation Foundation
- High-temperature resistant nano-copper produced by laser direct writing, preparation method and application thereof21 Jul 2026US 12,686,924 B2Zhejiang University
- Electroless plating systems and methods18 Nov 2025US 12,473,650 B1The Boeing Company
- Substrate liquid processing apparatus and substrate liquid processing method7 Oct 2025US 12,435,426 B2Tokyo Electron Limited
- Substrate processing apparatus and substrate processing method2 Sep 2025US 12,404,587 B2Tokyo Electron Limited
- High-temperature resistant nano-copper produced by laser direct writing, preparation method and application thereof20 Nov 2025US 2025/0354267 A1Zhejiang University
- Method for forming electroless plating electrode through selective cross-linking layer formation using laser17 Jul 2025US 2025/0230549 A1Andong National University Industry-Academic Cooperation Foundation
- Use of an aqueous alkaline composition for the electroless deposition of a metal or metal alloy on a metal surface of a substrate30 Jan 2025US 2025/0034718 A1Atotech Deutschland GmbH
- Plating Solutions for Composite PTFE Plating11 Jul 2024US 2024/0228816 A1Surface Technology, Inc.
- Depositing Station And Device For Generating Contact Metallizations4 Apr 2024US 2024/0110286 A1Pac Tech—Packaging Technologies GmbH
Most cited
By later US patents
- Electroless deposition of metal films with spray processor361US 6,065,424 ACornell Research Foundation, Inc. · 2000
- Electroless copper deposition method for preparing copper seed layers41US 6,664,122 B1Novellus Systems, Inc. · 2003
- Apparatus and method for electroless deposition of materials on semiconductor substrates35US 6,913,651 B2Blue29, LLC · 2005
- Atomic layer etching for enhanced bottom-up feature fill35US 9,837,312 B1Lam Research Corporation · 2017
- Methods and apparatus for airflow and heat management in electroless plating28US 6,713,122 B1Novellus Systems, Inc. · 2004