C23C 16/46
Characterised by the method used for heating the substrate
Official title: characterised by the method used for heating the substrate (C23C16/48, C23C16/50 take precedence)
C23C16/46 (Characterised by the method used for heating the substrate) appears on 1,949 US grants and 2,726 published applications in this corpus.
Search patents in C23C- Granted patents
- 1,949
- Published applications
- 2,726
- Assignees
- 770
- Inventors
- 5,632
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 4 | 0 |
| 1987 | 2 | 0 |
| 1988 | 6 | 0 |
| 1989 | 3 | 0 |
| 1990 | 2 | 0 |
| 1991 | 7 | 0 |
| 1992 | 16 | 0 |
| 1993 | 15 | 0 |
| 1994 | 22 | 0 |
| 1995 | 26 | 0 |
| 1996 | 35 | 0 |
| 1997 | 39 | 0 |
| 1998 | 35 | 0 |
| 1999 | 38 | 0 |
| 2000 | 55 | 0 |
| 2001 | 47 | 24 |
| 2002 | 49 | 52 |
| 2003 | 30 | 43 |
| 2004 | 39 | 42 |
| 2005 | 29 | 49 |
| 2006 | 16 | 31 |
| 2007 | 13 | 38 |
| 2008 | 17 | 38 |
| 2009 | 14 | 65 |
| 2010 | 22 | 66 |
| 2011 | 31 | 80 |
| 2012 | 33 | 96 |
| 2013 | 35 | 77 |
| 2014 | 57 | 65 |
| 2015 | 66 | 162 |
| 2016 | 74 | 124 |
| 2017 | 87 | 144 |
| 2018 | 92 | 135 |
| 2019 | 95 | 157 |
| 2020 | 107 | 161 |
| 2021 | 99 | 149 |
| 2022 | 97 | 206 |
| 2023 | 116 | 192 |
| 2024 | 126 | 213 |
| 2025 | 146 | 186 |
| 2026 | 93 | 131 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method of forming silicon carbide conversion coat on carbon using gas phase reactions6 Oct 2026US 12,753,492 B2Goodrich Corporation
- Heating apparatus and chemical vapor deposition system6 Oct 2026US 12,753,508 B2PlayNitride Display Co., Ltd.
- Substrate processing tube, substrate processing apparatus including the same, and substrate processing method using the apparatus29 Sep 2026US 12,747,497 B2Samsung Electronics Co., Ltd.
- Embedding method and processing system29 Sep 2026US 12,751,259 B2Tokyo Electron Limited
- Heating apparatus, CVD equipment including the heating apparatus22 Sep 2026US 12,742,241 B2Advanced Micro-Fabrication Equipment Inc. China
- Modulated reflection bottom cover plate design for cvd non-uniformity improvement8 Oct 2026US 2026/0308765 A1
- Sealing system for a reactor system1 Oct 2026US 2026/0297738 A1ASM IP Holding B. V.
- Plasma and Photon assisted Metal-Organic Chemical Vapor Deposition24 Sep 2026US 2026/0286510 A1PhantaField Inc.
- Atomic layer deposition device24 Sep 2026US 2026/0286519 A1Hanwha Solutions Corporation
- Wafer treating method24 Sep 2026US 2026/0286521 A1Asahi-Utou Technology Co., Ltd.
Most cited
By later US patents
- CVD Processing chamber1,003US 5,558,717 AAPPLIED Materials.Inc. · 1996
- Stage having electrostatic chuck and plasma processing apparatus using same921US 5,382,311 ATokyo Electron Limited · 1995
- Sequencing of the recipe steps for the optimal low-k HDP-CVD processing882US 5,937,323 AAPPLIED Materials.Inc. · 1999
- High temperature multi-layered alloy heater assembly and related methods858US 6,035,101 AAPPLIED Materials.Inc. · 2000
- Sequencing of the recipe steps for the optimal low-dielectric constant HDP-CVD Processing817US 6,217,658 B1APPLIED Materials.Inc. · 2001