Modulated reflection bottom cover plate design for cvd non-uniformity improvement
OwnerYao XU, Cheng CHENG +2inventors
InventorsYao XU, Cheng CHENG, Xi CEN, Kai WU
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OwnerYao XU, Cheng CHENG +2inventors
InventorsYao XU, Cheng CHENG, Xi CEN, Kai WU
Estimating the term…
A bottom cover plate that enables control of radiative heat transfer associated with a heating element inside a chamber for processing a substrate is provided. The bottom cover plate includes a plate body having a central opening configured to be disposed on a shaft of a pedestal of a substrate processing system. The plate body includes a facing surface configured to face a substrate disposed on a substrate support of the pedestal. The bottom cover plate further includes one or more removable emissivity-modifying modules disposed on the facing surface, wherein the one or more removable emissivity-modifying modules define regions having different emissivity. In some embodiments, the plate body includes a plurality of pinholes configured to receive one or more pins for removably retaining the one or more removable emissivity-modifying modules at selected locations on the facing surface.
A bottom cover plate for use in a semiconductor substrate processing system, comprising:
A method of processing a substrate in a substrate processing system, comprising:
Dependencies are inferred from the claim text.