C23C 16/45587
Mechanical means for changing the gas flow
Official title: {Mechanical means for changing the gas flow}
C23C16/45587 (Mechanical means for changing the gas flow) appears on 662 US grants and 857 published applications in this corpus.
Search patents in C23C- Granted patents
- 662
- Published applications
- 857
- Assignees
- 314
- Inventors
- 2,103
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 3 | 0 |
| 1986 | 4 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 4 | 0 |
| 1990 | 5 | 0 |
| 1991 | 3 | 0 |
| 1992 | 5 | 0 |
| 1993 | 6 | 0 |
| 1994 | 9 | 0 |
| 1995 | 6 | 0 |
| 1996 | 10 | 0 |
| 1997 | 7 | 0 |
| 1998 | 7 | 0 |
| 1999 | 6 | 0 |
| 2000 | 11 | 0 |
| 2001 | 22 | 6 |
| 2002 | 12 | 23 |
| 2003 | 21 | 21 |
| 2004 | 12 | 20 |
| 2005 | 12 | 32 |
| 2006 | 8 | 24 |
| 2007 | 8 | 27 |
| 2008 | 11 | 23 |
| 2009 | 5 | 28 |
| 2010 | 17 | 23 |
| 2011 | 7 | 47 |
| 2012 | 25 | 30 |
| 2013 | 26 | 41 |
| 2014 | 26 | 23 |
| 2015 | 27 | 42 |
| 2016 | 30 | 36 |
| 2017 | 25 | 37 |
| 2018 | 19 | 41 |
| 2019 | 34 | 29 |
| 2020 | 36 | 36 |
| 2021 | 33 | 33 |
| 2022 | 31 | 52 |
| 2023 | 24 | 52 |
| 2024 | 24 | 46 |
| 2025 | 43 | 47 |
| 2026 | 28 | 38 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Flow control arrangements, semiconductor processing systems having flow control arrangements, and flow control methods6 Oct 2026US 12,753,499 B2ASM IP Holding B. V.
- Substrate processing device and method for cleaning substrate processing device6 Oct 2026US 12,753,506 B2Jusung Engineering Co., Ltd.
- Chemical vapor deposition equipment and method therefor6 Oct 2026US 12,753,511 B2Advanced Micro-Fabrication Equipment Inc. China
- Apparatus for conducting plasma surface treatment, board treatment system having the same, and method of manufacturing semiconductor devices using the same6 Oct 2026US 12,755,942 B2New Power Plasma Co., Ltd.
- Liquid vaporizer29 Sep 2026US 12,747,500 B2ASM IP Holding B. V.
- Thin-film deposition apparatus and method8 Oct 2026US 2026/0308760 A1Picosun Oy
- Method of forming protective film on outer circumferential portion including bevel portion of substrate8 Oct 2026US 2026/0311973 A1Ebara Corporation
- Sealing system for a reactor system1 Oct 2026US 2026/0297738 A1ASM IP Holding B. V.
- A thin-film deposition apparatus24 Sep 2026US 2026/0286525 A1Picosun Oy
- Injection flange assemblies, semiconductor processing systems, and chamber arrangements including injection flange assemblies, and related methods of making injection flange assemblies and controlling fluid flow10 Sep 2026US 2026/0265917 A1ASM IP Holding B. V.
Most cited
By later US patents
- High pressure MOCVD reactor system860US 6,066,204 ABandwidth Semiconductor, LLC · 2000
- Rapid thermal processing apparatus for processing semiconductor wafers624US 5,444,217 AMoore Epitaxial, Inc. · 1995
- Chemical vapor deposition reactor and method of use thereof610US 4,976,996 ALam Research Corporation · 1990
- Atomic layer deposition reactor604US 6,820,570 B2Nobel Biocare Services AG · 2004
- Silicon oxide film formation method583US 6,955,836 B2Anelva Corporation · 2005