C23C 16/45591
Fixed means
Official title: {Fixed means, e.g. wings, baffles}
C23C16/45591 (Fixed means) appears on 429 US grants and 546 published applications in this corpus.
Search patents in C23C- Granted patents
- 429
- Published applications
- 546
- Assignees
- 228
- Inventors
- 1,474
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 4 | 0 |
| 1990 | 5 | 0 |
| 1991 | 3 | 0 |
| 1992 | 5 | 0 |
| 1993 | 6 | 0 |
| 1994 | 9 | 0 |
| 1995 | 4 | 0 |
| 1996 | 6 | 0 |
| 1997 | 6 | 0 |
| 1998 | 5 | 0 |
| 1999 | 5 | 0 |
| 2000 | 9 | 0 |
| 2001 | 15 | 4 |
| 2002 | 8 | 16 |
| 2003 | 10 | 11 |
| 2004 | 4 | 12 |
| 2005 | 7 | 18 |
| 2006 | 5 | 15 |
| 2007 | 5 | 16 |
| 2008 | 7 | 15 |
| 2009 | 4 | 18 |
| 2010 | 12 | 15 |
| 2011 | 3 | 30 |
| 2012 | 18 | 21 |
| 2013 | 19 | 25 |
| 2014 | 13 | 14 |
| 2015 | 16 | 28 |
| 2016 | 19 | 24 |
| 2017 | 14 | 20 |
| 2018 | 10 | 22 |
| 2019 | 18 | 16 |
| 2020 | 23 | 20 |
| 2021 | 22 | 23 |
| 2022 | 20 | 33 |
| 2023 | 16 | 40 |
| 2024 | 16 | 32 |
| 2025 | 35 | 30 |
| 2026 | 10 | 28 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Apparatus for conducting plasma surface treatment, board treatment system having the same, and method of manufacturing semiconductor devices using the same6 Oct 2026US 12,755,942 B2New Power Plasma Co., Ltd.
- Apparatus and system for delivering gas to a process chamber28 Jul 2026US 12,692,601 B2APPLIED Materials.Inc.
- Gas injection apparatus for layer deposition16 Jun 2026US 12,655,522 B2Hanwha Precision Machinery Co., Ltd.
- Substrate processing apparatus with flow control ring, and substrate processing method26 May 2026US 12,637,766 B2ASM IP Holding B. V.
- Flow velocity increasing device and apparatus for depositing thin film including the same19 May 2026US 12,630,923 B2Semes Co., Ltd.
- Thin-film deposition apparatus and method8 Oct 2026US 2026/0308760 A1Picosun Oy
- Method of forming protective film on outer circumferential portion including bevel portion of substrate8 Oct 2026US 2026/0311973 A1Ebara Corporation
- Sealing system for a reactor system1 Oct 2026US 2026/0297738 A1ASM IP Holding B. V.
- A thin-film deposition apparatus24 Sep 2026US 2026/0286525 A1Picosun Oy
- Injection flange assemblies, semiconductor processing systems, and chamber arrangements including injection flange assemblies, and related methods of making injection flange assemblies and controlling fluid flow10 Sep 2026US 2026/0265917 A1ASM IP Holding B. V.
Most cited
By later US patents
- High pressure MOCVD reactor system860US 6,066,204 ABandwidth Semiconductor, LLC · 2000
- Rapid thermal processing apparatus for processing semiconductor wafers624US 5,444,217 AMoore Epitaxial, Inc. · 1995
- Chemical vapor deposition reactor and method of use thereof610US 4,976,996 ALam Research Corporation · 1990
- Silicon oxide film formation method583US 6,955,836 B2Anelva Corporation · 2005
- Vapor growth apparatus and vapor growth method capable of growing good productivity560US 5,730,802 ASharp Kabushiki Kaisha · 1998