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US 12,637,766 B2Granted
Substrate processing apparatus with flow control ring, and substrate processing method
AssigneeASM IP Holding B.V.
InventorNaoto Tsuji
Life of this patent
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Abstract
Examples of a substrate processing apparatus includes a chamber, a susceptor provided in the chamber, a shower head provided above the susceptor, and a flow control ring having a shape to surround the susceptor, the flow control ring having a first top surface and a second top surface that has an annular shape and is provided closer to an inner edge of the flow control ring than the first top surface at a higher level than the first top surface, the second top surface being a sloped surface whose height decreases toward the first top surface.
Claims19
A substrate processing apparatus, comprising:
- a chamber;
- a susceptor provided in the chamber;
- a shower head provided above the susceptor;
- a flow control ring having a shape to surround the susceptor, the flow control ring having a first top surface and a second top surface, wherein the second top surface has an annular shape and is provided closer to an inner edge of the flow control ring than the first top surface at a higher level than the first top surface, the second top surface being a sloped surface whose height decreases toward and connects to the first top surface, wherein the second top surface, in a cross section of a vertical plane extending through a diameter of the flow control ring, comprises a curve connecting the inner edge of the flow control ring to the first top surface;
- an annular exhaust duct;
- and
- an annular slit formed between the flow control ring and the annular exhaust duct,
- wherein the slit is disposed below the annular exhaust duct,
- wherein the first top surface partially defines an annular flow path about the susceptor,
- wherein the first top surface is a planar surface, and
- wherein the first top surface partially defines the slit.
8 more elements
Dependencies are inferred from the claim text.