C23C 16/45504
Laminar flow
Official title: {Laminar flow}
C23C16/45504 (Laminar flow) appears on 236 US grants and 322 published applications in this corpus.
Search patents in C23C- Granted patents
- 236
- Published applications
- 322
- Assignees
- 141
- Inventors
- 716
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 5 | 0 |
| 1992 | 5 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 11 | 3 |
| 2002 | 1 | 2 |
| 2003 | 1 | 12 |
| 2004 | 1 | 4 |
| 2005 | 4 | 10 |
| 2006 | 3 | 6 |
| 2007 | 2 | 11 |
| 2008 | 5 | 16 |
| 2009 | 2 | 13 |
| 2010 | 7 | 16 |
| 2011 | 5 | 14 |
| 2012 | 9 | 11 |
| 2013 | 9 | 12 |
| 2014 | 9 | 13 |
| 2015 | 10 | 20 |
| 2016 | 10 | 11 |
| 2017 | 9 | 9 |
| 2018 | 8 | 19 |
| 2019 | 14 | 9 |
| 2020 | 8 | 10 |
| 2021 | 9 | 12 |
| 2022 | 10 | 17 |
| 2023 | 13 | 27 |
| 2024 | 10 | 16 |
| 2025 | 17 | 11 |
| 2026 | 14 | 18 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Apparatus for conducting plasma surface treatment, board treatment system having the same, and method of manufacturing semiconductor devices using the same6 Oct 2026US 12,755,942 B2New Power Plasma Co., Ltd.
- Atmospheric pressure plasma reduction of copper oxide to copper metal5 May 2026US 12,617,146 B1Surfx Technologies LLC
- Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium14 Apr 2026US 12,601,058 B2Kokusai Electric Corporation
- Methods of manufacturing plasma generating cells for a plasma source14 Apr 2026US 12,601,621 B2APPLIED Materials.Inc.
- Chemical vapor deposition apparatus with multi-zone injection block24 Mar 2026US 12,584,223 B2Veeco Instruments Inc.
- Thin-film deposition apparatus and method8 Oct 2026US 2026/0308760 A1Picosun Oy
- A thin-film deposition apparatus for batch processing24 Sep 2026US 2026/0286515 A1Picosun Oy
- A thin-film deposition apparatus reaction chamber24 Sep 2026US 2026/0286520 A1Picosun Oy
- A thin-film deposition apparatus24 Sep 2026US 2026/0286525 A1Picosun Oy
- A thin-film deposition apparatus cluster17 Sep 2026US 2026/0275520 A1Picosun Oy
Most cited
By later US patents
- Chemical vapor deposition reactor and method of use thereof610US 4,976,996 ALam Research Corporation · 1990
- Gas delivery apparatus and method for atomic layer deposition586US 6,916,398 B2APPLIED Materials.Inc. · 2005
- Semiconductor processing reactor and components thereof510US 9,394,608 B2ASM America, Inc. · 2016
- Method and a device for epitaxial growth of objects by chemical vapor deposition500US 6,093,253 AABB Research Ltd. · 2000
- Integration of ALD tantalum nitride for copper metallization495US 7,049,226 B2APPLIED Materials.Inc. · 2006