C23C 16/4481
By evaporation using carrier gas in contact with the source material
Official title: {by evaporation using carrier gas in contact with the source material (C23C16/4486 takes precedence)}
C23C16/4481 (By evaporation using carrier gas in contact with the source material) appears on 836 US grants and 983 published applications in this corpus.
Search patents in C23C- Granted patents
- 836
- Published applications
- 983
- Assignees
- 369
- Inventors
- 2,166
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 4 | 0 |
| 1981 | 4 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 5 | 0 |
| 1986 | 4 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 4 | 0 |
| 1990 | 11 | 0 |
| 1991 | 2 | 0 |
| 1992 | 8 | 0 |
| 1993 | 12 | 0 |
| 1994 | 9 | 0 |
| 1995 | 16 | 0 |
| 1996 | 17 | 0 |
| 1997 | 12 | 0 |
| 1998 | 23 | 0 |
| 1999 | 27 | 0 |
| 2000 | 40 | 0 |
| 2001 | 29 | 13 |
| 2002 | 21 | 24 |
| 2003 | 16 | 26 |
| 2004 | 26 | 36 |
| 2005 | 14 | 32 |
| 2006 | 24 | 46 |
| 2007 | 13 | 41 |
| 2008 | 15 | 40 |
| 2009 | 24 | 38 |
| 2010 | 23 | 29 |
| 2011 | 16 | 29 |
| 2012 | 23 | 23 |
| 2013 | 27 | 29 |
| 2014 | 15 | 36 |
| 2015 | 23 | 34 |
| 2016 | 20 | 33 |
| 2017 | 18 | 37 |
| 2018 | 29 | 26 |
| 2019 | 23 | 40 |
| 2020 | 21 | 40 |
| 2021 | 27 | 49 |
| 2022 | 24 | 59 |
| 2023 | 39 | 60 |
| 2024 | 40 | 71 |
| 2025 | 46 | 41 |
| 2026 | 34 | 51 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Flow control arrangements, semiconductor processing systems having flow control arrangements, and flow control methods6 Oct 2026US 12,753,499 B2ASM IP Holding B. V.
- Liquid vaporizer29 Sep 2026US 12,747,500 B2ASM IP Holding B. V.
- Embedding method and processing system29 Sep 2026US 12,751,259 B2Tokyo Electron Limited
- Dual ampoule separator plate and method1 Sep 2026US 12,723,311 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Methods and apparatus for solid source refill18 Aug 2026US 12,709,800 B2ASM IP Holding B. V.
- Semiconductor wafer processing tool with improved leak check8 Oct 2026US 2026/0314308 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Group 5 metal precursor compound for thin film deposition, and method for forming group 5 metal-containing thin film by using same10 Sep 2026US 2026/0265913 A1EGTM Co., Ltd.
- Method and Device for Producing a SiC Solid Material10 Sep 2026US 2026/0265951 A1
- Multi-chambered chemical solid precursor ampoule27 Aug 2026US 2026/0250841 A1Versum Materials US, LLC
- Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatus20 Aug 2026US 2026/0242944 A1Kokusai Electric Corporation
Most cited
By later US patents
- Vapor mass flow control system702US 4,436,674 AJ. C. Schumacher Co. · 1984
- Deposition reactor having vaporizing, mixing and cleaning capabilities631US 6,454,860 B2APPLIED Materials.Inc. · 2002
- Vapor mass flow control system629US 4,393,013 AJ. C. Schumacher Co. · 1983
- Delivery systems for efficient vaporization of precursor source material593US 6,909,839 B2Advanced Technology Materials, Inc. · 2005
- Apparatus for producing compound semiconductor devices591US 5,496,408 AMitsubishi Denki Kabushiki Kaisha · 1996