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US 2026/0242944 A1Published application
Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatus
AssigneeKokusai Electric Corporation
InventorsShingo NOHARA, Kiyohisa ISHIBASHI, Yoma YAMANE, Jumpei SHIMURA
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Abstract
A technique includes: (a) setting a supply amount of a modifying agent based on a relationship between the supply amount of the modifying agent and a saturated adsorption property of a precursor on the substrate; and (b) supplying the modifying agent to the substrate based on the set supply amount.
Claims20
A method of processing a substrate, comprising:
- (a) setting a supply amount of a modifying agent based on a relationship between the supply amount of the modifying agent and a saturated adsorption property of a precursor on the substrate;
- and
- (b) supplying the modifying agent to the substrate based on the set supply amount.
A non-transitory computer-readable recording medium storing a program that causes, by a computer, a substrate processing apparatus to perform a process comprising:
- (a) setting a supply amount of a modifying agent based on a relationship between the supply amount of the modifying agent and a saturated adsorption property of a precursor on a substrate;
- and
- (b) supplying the modifying agent to the substrate based on the set supply amount.
A substrate processing apparatus comprising:
- a modifying agent supply system configured to supply a modifying agent to a substrate;
- and
- a controller configured to be capable of controlling the modifying agent supply system so as to perform a process including:
- (a) setting a supply amount of the modifying agent based on a relationship between the supply amount of the modifying agent and a saturated adsorption property of a precursor on the substrate;
- and (b) supplying the modifying agent to the substrate based on the set supply amount.
2 more elements
Dependencies are inferred from the claim text.