C23C 16/4482
By bubbling of carrier gas through liquid source material
Official title: {by bubbling of carrier gas through liquid source material}
C23C16/4482 (By bubbling of carrier gas through liquid source material) appears on 216 US grants and 251 published applications in this corpus.
Search patents in C23C- Granted patents
- 216
- Published applications
- 251
- Assignees
- 162
- Inventors
- 665
- Latest grant
- 21 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 4 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 6 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 4 | 0 |
| 1994 | 2 | 0 |
| 1995 | 6 | 0 |
| 1996 | 8 | 0 |
| 1997 | 1 | 0 |
| 1998 | 5 | 0 |
| 1999 | 0 | 0 |
| 2000 | 6 | 0 |
| 2001 | 5 | 6 |
| 2002 | 1 | 4 |
| 2003 | 3 | 4 |
| 2004 | 4 | 8 |
| 2005 | 3 | 7 |
| 2006 | 8 | 5 |
| 2007 | 4 | 15 |
| 2008 | 4 | 12 |
| 2009 | 4 | 14 |
| 2010 | 5 | 9 |
| 2011 | 5 | 7 |
| 2012 | 7 | 6 |
| 2013 | 12 | 12 |
| 2014 | 3 | 11 |
| 2015 | 5 | 8 |
| 2016 | 6 | 10 |
| 2017 | 2 | 15 |
| 2018 | 14 | 6 |
| 2019 | 5 | 7 |
| 2020 | 8 | 9 |
| 2021 | 3 | 13 |
| 2022 | 5 | 12 |
| 2023 | 9 | 18 |
| 2024 | 13 | 18 |
| 2025 | 11 | 9 |
| 2026 | 7 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Ampoule for a semiconductor manufacturing precursor21 Jul 2026US 12,686,004 B2APPLIED Materials.Inc.
- Semiconductor wafer processing tool with improved leak check14 Jul 2026US 12,685,071 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods12 May 2026US 12,628,603 B2ASM IP Holding B. V.
- Canister, precursor transfer system having the same and method for measuring precursor remaining amount thereof31 Mar 2026US 12,590,366 B2Samsung Electronics Co., Ltd.
- Metalorganic chemical vapor phase deposition apparatus having bubbler with first supply section leading to reactor, first, second and third mass flow controller and pressure sensor24 Feb 2026US 12,559,862 B2AZUR SPACE Solar Power GmbH
- Semiconductor wafer processing tool with improved leak check8 Oct 2026US 2026/0314308 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatus20 Aug 2026US 2026/0242944 A1Kokusai Electric Corporation
- Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods20 Aug 2026US 2026/0247900 A1ASM IP Holding B. V.
- Methods and article for storing organic tin compounds11 Jun 2026US 2026/0161086 A1Gelest, Inc.
- Fluid control device and substrate processing apparatus7 May 2026US 2026/0130155 A1Tokyo Electron Limited
Most cited
By later US patents
- Vapor mass flow control system702US 4,436,674 AJ. C. Schumacher Co. · 1984
- Vapor mass flow control system629US 4,393,013 AJ. C. Schumacher Co. · 1983
- Apparatus for producing compound semiconductor devices591US 5,496,408 AMitsubishi Denki Kabushiki Kaisha · 1996
- Delivery system for organometallic compounds576US 5,199,603 A1993
- Container for liquid metal organic compound569US 5,589,110 A1996