C23C 14/541
Heating or cooling of the substrates
Official title: {Heating or cooling of the substrates}
C23C14/541 (Heating or cooling of the substrates) appears on 691 US grants and 836 published applications in this corpus.
Search patents in C23C- Granted patents
- 691
- Published applications
- 836
- Assignees
- 431
- Inventors
- 2,230
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 4 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 4 | 0 |
| 1981 | 4 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 6 | 0 |
| 1985 | 15 | 0 |
| 1986 | 6 | 0 |
| 1987 | 2 | 0 |
| 1988 | 5 | 0 |
| 1989 | 11 | 0 |
| 1990 | 3 | 0 |
| 1991 | 5 | 0 |
| 1992 | 8 | 0 |
| 1993 | 9 | 0 |
| 1994 | 10 | 0 |
| 1995 | 4 | 0 |
| 1996 | 11 | 0 |
| 1997 | 11 | 0 |
| 1998 | 20 | 0 |
| 1999 | 13 | 0 |
| 2000 | 18 | 0 |
| 2001 | 19 | 8 |
| 2002 | 12 | 14 |
| 2003 | 9 | 14 |
| 2004 | 9 | 12 |
| 2005 | 12 | 21 |
| 2006 | 7 | 16 |
| 2007 | 7 | 17 |
| 2008 | 5 | 18 |
| 2009 | 11 | 25 |
| 2010 | 9 | 36 |
| 2011 | 8 | 28 |
| 2012 | 12 | 38 |
| 2013 | 15 | 26 |
| 2014 | 24 | 37 |
| 2015 | 14 | 26 |
| 2016 | 18 | 36 |
| 2017 | 26 | 40 |
| 2018 | 20 | 48 |
| 2019 | 37 | 46 |
| 2020 | 36 | 52 |
| 2021 | 36 | 59 |
| 2022 | 30 | 63 |
| 2023 | 36 | 49 |
| 2024 | 43 | 46 |
| 2025 | 42 | 38 |
| 2026 | 19 | 23 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- External cooling assembly for substrate support6 Oct 2026US 12,755,943 B2APPLIED Materials.Inc.
- Deposition system and method1 Sep 2026US 12,727,404 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Coating drum and system for vapor deposition11 Aug 2026US 12,703,909 B2Skycap Investment Holdings Inc.
- Film formation apparatus and film formation method of gallium nitride film11 Aug 2026US 12,703,910 B2Japan Display Inc.
- Method and apparatus for continuous chained energy ion implantation4 Aug 2026US 12,700,562 B2Axcelis Technologies, Inc.
- Film deposition apparatus1 Oct 2026US 2026/0297726 A1Tokyo Electron Limited
- Method and device for plasma heating of the internal walls of a vacuum furnace1 Oct 2026US 2026/0302140 A1
- Integrated junction silicide and selective metal capping with pullback24 Sep 2026US 2026/0293633 A1
- Remote laser-based sample heater with sample exchange turret27 Aug 2026US 2026/0250834 A1UT-Battelle, LLC
- Degassing method, degassing chamber, and semiconductor processing apparatus20 Aug 2026US 2026/0242931 A1Beijing Naura Microelectronics Equipment Co., Ltd.
Most cited
By later US patents
- Heater block for heating wafer537US 6,207,932 B1Hyundai Electronics Industries Co., Ltd. · 2001
- Method and apparatus for controlling sample temperature378US 4,565,601 AHitachi, Ltd. · 1986
- Apparatus and method for high throughput sputtering366US 5,683,561 AConner Peripherals, Inc. · 1997
- Method for front end of line fabrication265US 7,396,480 B2APPLIED Materials.Inc. · 2008
- Method for removing oxides188US 8,846,163 B2APPLIED Materials.Inc. · 2014