Degassing method, degassing chamber, and semiconductor processing apparatus

Abstract

A degassing chamber includes a housing, a substrate container, a light source component, a reflection tube, a movable reflection plate, and a temperature controller. A substrate transferring opening is formed on a sidewall of the housing. The substrate container is configured to carry the one or more substrates and is movable in the housing along a vertical direction. The light source component is configured to provide heat to the degassing chamber. The reflection tube is located between a sidewall of the housing and the light source component, and configured to reflect the heat from the light source component. A notch is provided on the reflection tube corresponding to the substrate transferring opening. The movable reflection plate is configured to move along the vertical direction and reflect the heat through the notch of the reflection tube. The temperature controller is configured to control an internal temperature of the degassing chamber.

Dependencies are inferred from the claim text.