B81C 2201/0104
Chemical-mechanical polishing [cmp]
Official title: Chemical-mechanical polishing [CMP]
B81C2201/0104 (Chemical-mechanical polishing [cmp]) appears on 64 US grants and 85 published applications in this corpus.
Search patents in B81C- Granted patents
- 64
- Published applications
- 85
- Assignees
- 52
- Inventors
- 180
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 1 |
| 2003 | 2 | 4 |
| 2004 | 0 | 0 |
| 2005 | 1 | 4 |
| 2006 | 0 | 2 |
| 2007 | 3 | 0 |
| 2008 | 0 | 1 |
| 2009 | 1 | 1 |
| 2010 | 1 | 2 |
| 2011 | 0 | 3 |
| 2012 | 2 | 3 |
| 2013 | 1 | 1 |
| 2014 | 1 | 2 |
| 2015 | 1 | 2 |
| 2016 | 1 | 9 |
| 2017 | 7 | 8 |
| 2018 | 8 | 4 |
| 2019 | 3 | 2 |
| 2020 | 7 | 6 |
| 2021 | 3 | 6 |
| 2022 | 3 | 1 |
| 2023 | 3 | 6 |
| 2024 | 7 | 5 |
| 2025 | 1 | 6 |
| 2026 | 2 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Anchor structure8 Sep 2026US 12,729,107 B2Lawrence Semiconductor Research Laboratory, Inc.
- Micro-electro-mechanical system (MEMs) devices including sidewall stoppers27 Jan 2026US 12,534,362 B2Vanguard International Semiconductor Corporation
- CMUT-on-CMOS ultrasonic transducer by bonding active wafers and manufacturing method thereof28 Jan 2025US 12,208,416 B2Zhejiang Xiansheng Technology Co., Ltd.
- Conductive bond structure to increase membrane sensitivity in MEMS device12 Nov 2024US 12,139,399 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Adaptive cavity thickness control for micromachined ultrasonic transducer devices27 Aug 2024US 12,070,773 B2Bfly Operations, Inc.
- Anchor structure1 Oct 2026US 2026/0296876 A1Lawrence Semiconductor Research Laboratory, Inc.
- Method for producing a microstructural element and microstructural element10 Sep 2026US 2026/0265049 A1Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
- Method for producing a silicon layer system with electrical connections27 Aug 2026US 2026/0250122 A1
- Method for producing a micromechanical layer structure with high aspect ratio and micromechanical layer structure21 May 2026US 2026/0138867 A1
- Method of fabricating micro-electro-mechanical system (mems) device30 Apr 2026US 2026/0116744 A1Vanguard International Semiconductor Corporation
Most cited
By later US patents
- Monolithic silicon membrane device fabrication process37US 4,978,421 AInternational Business Machines Corporation · 1990
- Method of fabrication of a microfluidic device27US 7,261,824 B2Micronit Microfluidics B.V. · 2007
- Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures23US 7,271,888 B2Microfabrica Inc. · 2007
- Method for fabricating micro inertia sensor19US 6,242,276 B1Samsung Electro-Mechanics Co., Ltd. · 2001
- Method of fabricating a device having a desired non-planar surface or profile and device produced thereby12US 6,884,732 B2The Regents of the University of Michigan · 2005