Method of fabrication of a microfluidic device
AssigneeMicronit Microfluidics B.V.
InventorsStefan Schlautmann, Albert Van den Berg, Johannes Gerardus Elisabeth Gardeniers
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Abstract
The present invention relates to a method of fabricating a microfluidic device including at least two substrates provided with a fluid channel, comprising the steps of: a) etching at least a channel and one or more fluid ports in a first and/or a second substrate; b) depositing a first layer on a surface of the second substrate; c) partially removing the first layer in accordance with a predefined geometry; d) depositing a second layer on top of the first layer and the substrate surface; e) planarizing the second layer so as to smooth the upper surface thereof; f) aligning the first and second substrate; g) bonding the first substrate on the planarized second layer of the second substrate.
Claims18
A method of fabricating a microfluidic device including at least two substrates provided with a fluid channel, comprising the steps of:
- a) etching at least a channel and one or more fluid ports in a first and/or a second substrate;
- b) depositing a first layer on a surface of the second substrate;
- c) partially removing the first layer in accordance with a predefined geometry;
- d) depositing a second layer on top of the first layer and the substrate surface;
- e) planarizing the second layer so as to smooth the upper surface thereof;
- f) aligning the first and second substrate;
- and
- g) bonding the first substrate on the planarized second layer of the second substrate,
- wherein step a) comprises etching of one or more contact openings in the first substrate so as to provide space for electrical connectors.
A method of fabricating a microfluidic device including at least two substrates provided with a fluid channel, comprising the steps of:
- a) etching at least a channel and one or more fluid ports in a first and/or a second substrate;
- b) depositing a first layer on a surface of the second substrate;
- c) partially removing the first layer in accordance with a predefined geometry;
- d) depositing a second layer on top of the first layer and the substrate surface;
- e) planarizing the second layer so as to smooth the upper surface thereof;
- f) aligning the first and second substrate;
- and
- g) bonding the first substrate on the planarized second layer of the second substrate,
- wherein step b) of depositing a conductive layer comprises depositing a metal layer and wherein step b) of depositing the first layer further comprises depositing a relatively thin adhesion layer, depositing a relatively thick metal layer and depositing an additional relatively thin adhesion layer.
A method of fabricating a microfluidic device including at least two substrates provided with a fluid channel, comprising the steps of:
- a) etching at least a channel and one or more fluid ports in a first and/or a second substrate;
- b) depositing a first layer on a surface of the second substrate;
- c) partially removing the first layer in accordance with a predefined geometry:
- d) depositing a second layer on top of the first layer and the substrate surface;
- e) planarizing the second layer so as to smooth the upper surface thereof;
- f) aligning the first and second substrate;
- and
- g) bonding the first substrate on the planarized second layer of the second substrate, after step e) comprising the step of partially removing at least the second layer so as to expose predefined parts of the first layer.
A method of fabricating a microfluidic device including at least two substrates provided with a fluid channel, comprising the steps of:
- a) etching at least a channel and one or more fluid ports in a first and/or a second substrate;
- b) depositing a first layer on a surface of the second substrate;
- c) partially removing the first layer in accordance with a predefined geometry;
- d) depositing a second layer on top of the first layer and the substrate surface;
- e) planarizing the second layer so as to smooth the upper surface thereof;
- f) aligning the first and second substrate;
- and
- g) bonding the first substrate on the planarized second layer of the second substrate,
- wherein step d) of depositing the insulating layer comprises applying a chemical vapour deposition process, the second layer comprising a layer of SiO2, SiN and/or SiC.
A method of fabricating a microfluidic device including at least two substrates provided with a fluid channel, comprising the steps of:
- a) etching at least a channel and one or more fluid ports in a first and/or a second substrate;
- b) depositing a first layer on a surface of the second substrate;
- c) partially removing the first layer in accordance with a predefined geometry:
- d) depositing a second layer on top of the first layer and the substrate surface;
- e) planarizing the second layer so as to smooth the upper surface thereof;
- f) aligning the first and second substrate;
- and
- g) bonding the first substrate on the planarized second layer of the second substrate,
- wherein step e) of planarizing the insulating layer comprises applying a chemical mechanical polishing process on the second layer.
A method of fabricating a microfluidic device including at least two substrates provided with a fluid channel, comprising the steps of:
- a) etching at least a channel and one or more fluid ports in a first and/or a second substrate;
- b) depositing a first layer on a surface of the second substrate;
- c) partially removing the first layer in accordance with a predefined geometry;
- d) depositing a second layer on top of the first layer and the substrate surface;
- e) planarizing the second layer so as to smooth the upper surface thereof:
- f) aligning the first and second substrate;
- and
- g) bonding the first substrate on the planarized second layer of the second substrate, the method further comprising the steps of filling the channel and/or the ports with filler material, planarizing the second layer and removing the filler material.
Dependencies are inferred from the claim text.