H10W 72/965
Providing thermal transfer
Official title: {Providing thermal transfer}
H10W72/965 (Providing thermal transfer) appears on 103 US grants and 155 published applications in this corpus.
Search patents in H10W- Granted patents
- 103
- Published applications
- 155
- Assignees
- 40
- Inventors
- 246
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2006 | 0 | 1 |
| 2007 | 0 | 1 |
| 2008 | 1 | 1 |
| 2009 | 1 | 1 |
| 2010 | 1 | 1 |
| 2011 | 1 | 0 |
| 2012 | 1 | 4 |
| 2013 | 4 | 4 |
| 2014 | 2 | 5 |
| 2015 | 2 | 3 |
| 2016 | 3 | 3 |
| 2017 | 3 | 2 |
| 2018 | 3 | 7 |
| 2019 | 3 | 7 |
| 2020 | 11 | 13 |
| 2021 | 6 | 13 |
| 2022 | 10 | 22 |
| 2023 | 8 | 19 |
| 2024 | 16 | 18 |
| 2025 | 18 | 17 |
| 2026 | 9 | 13 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package with stacked dies and thermal substrate encapsulation6 Oct 2026US 12,757,780 B2Taiwan Semiconductor Manufacturing Company.Ltd
- 3D IC structure18 Aug 2026US 12,713,625 B2Etron Technology, Inc.
- Type of bumpless and wireless semiconductor device28 Jul 2026US 12,696,704 B2NXP USA, Inc.
- Package structure and packaging method23 Jun 2026US 12,667,014 B2Changxin Memory Technologies, Inc.
- Semiconductor device and manufacturing method thereof2 Jun 2026US 12,648,459 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device8 Oct 2026US 2026/0314474 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Photoelectric conversion apparatus, photoelectric conversion system, and moving object23 Jul 2026US 2026/0215018 A1Canon Kabushiki Kaisha
- Stacked fets with thermoelectric cooling11 Jun 2026US 2026/0165119 A1International Business Machines Corporation
- Semiconductor Device and Method of Fabricating the Same4 Jun 2026US 2026/0157166 A1United Microelectronics Corp.
- Semiconductor package21 May 2026US 2026/0144056 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Three-dimensional device fabrication method248US 7,354,798 B2International Business Machines Corporation · 2008
- Low temperature bonded structures178US 10,790,262 B2Invensas Bonding Technologies, Inc. · 2020
- Large metal pads over TSV63US 11,393,779 B2Invensas Bonding Technologies, Inc. · 2022
- Nanowire bonding interconnect for fine-pitch microelectronics61US 11,387,202 B2Invensas Corporation · 2022
- On-chip heat spreader29US 8,314,483 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2012