Stacked fets with thermoelectric cooling
AssigneeInternational Business Machines Corporation
InventorsWuKang Kim, Ruilong Xie, Tao Li, Qianwen Chen, Joshua Mark Rubin
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Abstract
Semiconductor devices include a first device layer that includes thermal vias. A second device layer, over the first device layer, has heat transfer pads of different doping types in contact with the thermal vias. A back-end-of-line (BEOL) layer over the second device layer includes a cooling plate and heat transfer structures that connect the heat transfer pads to the cooling plate. A backside power distribution layer is under the first device layer. A cooler is mounted to the backside power distribution layer.
Claims20
A semiconductor device, comprising:
- a first device layer comprising thermal vias;
- a second device layer over the first device layer having heat transfer pads of semiconductor materials with different doping types in contact with the thermal vias;
- a back-end-of-line (BEOL) layer over the second device layer wherein the backside power distribution layer comprises a cooling plate and heat transfer structures that connect the heat transfer pads to the cooling plate;
- a backside power distribution layer under the first device layer;
- and
- a cooler mounted to the backside power distribution layer.
A semiconductor device, comprising:
- a first device layer comprising thermal vias;
- a second device layer over the first device layer having heat transfer pads of different doping types in contact with the thermal vias;
- a back-end-of-line (BEOL) layer over the second device layer;
- a backside power distribution layer under the first device layer wherein the backside power distribution layer comprises a cooling plate and a heat transfer structure that connects the thermal vias to the cooling plate;
- and
- a cooler mounted to the BEOL layer.
A semiconductor device, comprising:
- a first device layer comprising heat transfer pads;
- a second device layer over the first device layer having thermal vias in contact with the heat transfer pads;
- a back-end-of-line (BEOL) layer over the second device layer;
- a backside power distribution layer under the first device layer, wherein the backside power distribution layer comprises a cooling plate and heat transfer structures that connect the heat transfer pads to the cooling plate;
- and
- a cooler mounted to the BEOL layer.
Dependencies are inferred from the claim text.