Semiconductor package

A semiconductor package comprising:

• a base substrate;
• a first chip group comprising a plurality of first chips on the base substrate;
• a first molding film extending around the first chip group;
• a first redistribution layer on the first molding film;
• a second chip group comprising a plurality of second chips on the first redistribution layer;
• and
• a plurality of first outer posts electrically connected to the base substrate and the first redistribution layer, and extending into the first molding film,
• wherein the plurality of first outer posts are free from overlap with the first chip group and the second chip group in a first direction perpendicular to an upper surface of the base substrate, and
• wherein at least one first outer post of the plurality of first outer posts is electrically connected to at least one second chip of the plurality of second chips through the first redistribution layer.

A semiconductor package comprising:

• a redistribution substrate;
• a plurality of chips that are on the redistribution substrate and are offset from each other in a first direction parallel to an upper surface of the redistribution substrate;
• a molding film extending around the plurality of chips;
• a redistribution layer on the molding film;
• and
• a plurality of outer posts that are on the redistribution substrate, electrically connected to the redistribution layer, and extend into the molding film,
• wherein the redistribution substrate comprises:
• a first chip connection pad in a chip area facing the plurality of chips in a direction perpendicular to the upper surface of the redistribution substrate, and electrically connected to a signal pad of a first chip of the plurality of chips;
• a second chip connection pad in the chip area, and electrically connected to a thermal pad of the first chip;
• and
• a plurality of outer connection pads electrically connected to the first chip connection pad or the second chip connection pad, and
• wherein the plurality of outer posts are on the plurality of outer connection pads.