H10W 72/655
Of outermost layers of multilayered strap connectors
Official title: {of outermost layers of multilayered strap connectors, e.g. material of a coating}
H10W72/655 (Of outermost layers of multilayered strap connectors) appears on 328 US grants and 382 published applications in this corpus.
Search patents in H10W- Granted patents
- 328
- Published applications
- 382
- Assignees
- 128
- Inventors
- 728
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 4 | 0 |
| 2001 | 4 | 0 |
| 2002 | 3 | 5 |
| 2003 | 4 | 3 |
| 2004 | 3 | 4 |
| 2005 | 3 | 8 |
| 2006 | 5 | 25 |
| 2007 | 4 | 21 |
| 2008 | 11 | 27 |
| 2009 | 18 | 18 |
| 2010 | 18 | 14 |
| 2011 | 19 | 14 |
| 2012 | 13 | 11 |
| 2013 | 18 | 26 |
| 2014 | 14 | 20 |
| 2015 | 17 | 30 |
| 2016 | 33 | 33 |
| 2017 | 27 | 35 |
| 2018 | 18 | 16 |
| 2019 | 26 | 4 |
| 2020 | 8 | 8 |
| 2021 | 7 | 16 |
| 2022 | 5 | 13 |
| 2023 | 7 | 7 |
| 2024 | 14 | 13 |
| 2025 | 7 | 7 |
| 2026 | 5 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Electrical connection element and correspond method and apparatus with outgassing grooves that remove trapped gasses14 Apr 2026US 12,604,774 B2Infineon Technologies AG
- Clips for semiconductor package and related methods24 Sep 2026US 2026/0293708 A1Semiconductor Components Industries, LLC
- Method of manufacturing semiconductor devices and corresponding semiconductor device3 Sep 2026US 2026/0262526 A1STMicroelectronics International N. V.
- Clip for die top interconnection of power module applications21 May 2026US 2026/0144121 A1
- Clip-bonded semiconductor package and corresponding method of manufacturing such a semiconductor package2 Apr 2026US 2026/0096462 A1Nexperia B. V.
- Liquid metal interconnects for power semiconductor modules11 Dec 2025US 2025/0379167 A1The Board of Trustees of The University of Alabama
Most cited
By later US patents
- Leadless semiconductor device and method for making the same346US 5,172,214 AMotorola, Inc. · 1992
- Current sensor139US 7,598,601 B2Allegro MicroSystems, LLC · 2009
- Method of encapsulating a microelectronic assembly utilizing a barrier118US 6,130,116 ATessera, Inc. · 2000
- Semiconductor device package114US 7,045,884 B2International Rectifier Corporation · 2006
- Thin, thermally enhanced flip chip in a leaded molded package91US 6,891,256 B2Fairchild Semiconductor Corporation · 2005