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US 2026/0096462 A1Published application
Clip-bonded semiconductor package and corresponding method of manufacturing such a semiconductor package
AssigneeNexperia B.V.
InventorsTim Böttcher, Hoan Vu, Haibo Fan, Khairul Ikhsan Yahaya, Wai Keung Ho, To Kam Ng, Dirk Bernhardt
Life of this patent
Estimating the term…
Abstract
A clip-bonded semiconductor package including: a semiconductor die including a bond pad on a top side of the semiconductor die, the bond pad is arranged to receive a bond clip, the bond clip is also arranged to provide electrical connection to the bond pad via a connection part of the bond clip, the bond clip further includes a buffer layer provided to at least the connection part. A hardness of a material of the buffer layer is lower than a hardness of a material of the bond clip.
Claims18
A clip-bonded semiconductor package comprising:
- a semiconductor die comprising a bond pad on a top side of the semiconductor die, wherein the bond pad is arranged to receive a bond clip;
- wherein the bond clip is arranged to provide electrical connection to the bond pad via a connection part of the bond clip, wherein the bond clip further comprises a buffer layer provided to at least the connection part, and wherein the buffer layer has a material that has a hardness that is lower than a hardness of a material of the bond clip.
Dependencies are inferred from the claim text.