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US 12,672,556 B2Granted
Clips for semiconductor package and related methods
AssigneeSemiconductor Components Industries, LLC
InventorsInpil Yoo, Seungwon Im, JooYang Eom, Jerome Teysseyre
Life of this patent
Estimating the term…
Abstract
Implementations of a clip may include a first copper layer directly bonded to a first side of a ceramic layer, a second copper layer directly bonded to a second side of the ceramic layer, the second side of the ceramic layer opposite the first side of the ceramic layer, and a plurality of channels partially etched into a thickness of the second copper layer.
Claims15
A semiconductor package comprising:
- a direct bond copper (DBC) clip coupled to a plurality of semiconductor die;
- a second DBC clip coupled to the plurality of semiconductor die;
- and
- a substrate directly coupled to the DBC clip and the second DBC clip;
- wherein the plurality of die are coupled between one of the DBC clip or the second DBC clip and the substrate.
2 more elements
A semiconductor package comprising:
- a first direct bond copper (DBC) clip coupled directly over two or more semiconductor die of a plurality of semiconductor die;
- a second DBC clip coupled directly over two or more semiconductor die of the plurality of semiconductor die;
- and
- a substrate directly coupled to the first DBC clip and the second DBC clip;
- wherein the plurality of die are coupled between one of the first DBC clip or the second DBC clip and the substrate;
- wherein the first DBC clip and the second DBC clip are coupled over the plurality of die in a side-by-side orientation;
- and
- wherein the first DBC clip and the second DBC clip each comprise a plurality of channels formed in a copper layer.
5 more elements
A semiconductor package comprising:
- a direct bond copper (DBC) clip coupled directly over two or more semiconductor die of a plurality of semiconductor die;
- a second DBC clip coupled directly over two or more semiconductor die of the plurality of semiconductor die;
- and
- a substrate coupled directly under the plurality of die and directly coupled to the DBC clip and the second DBC clip;
- wherein the plurality of die are coupled between one of the DBC clip or the second DBC clip and the substrate.
2 more elements
Dependencies are inferred from the claim text.