H10W 72/646
The connected ends being on auxiliary connecting means on bond pads
Official title: {the connected ends being on auxiliary connecting means on bond pads, e.g. on a bump connector}
H10W72/646 (The connected ends being on auxiliary connecting means on bond pads) appears on 325 US grants and 419 published applications in this corpus.
Search patents in H10W- Granted patents
- 325
- Published applications
- 419
- Assignees
- 86
- Inventors
- 692
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 2 |
| 2002 | 2 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 3 |
| 2009 | 1 | 1 |
| 2010 | 2 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 4 |
| 2013 | 3 | 7 |
| 2014 | 10 | 14 |
| 2015 | 12 | 22 |
| 2016 | 14 | 22 |
| 2017 | 20 | 31 |
| 2018 | 21 | 31 |
| 2019 | 31 | 32 |
| 2020 | 24 | 55 |
| 2021 | 42 | 54 |
| 2022 | 39 | 43 |
| 2023 | 37 | 30 |
| 2024 | 31 | 28 |
| 2025 | 24 | 25 |
| 2026 | 9 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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Most cited
By later US patents
- Semiconductor device, manufacturing method thereof and aggregate type semiconductor device181US 6,208,021 B1Oki Electric Industry Co., Ltd. · 2001
- Reinforcement of lead bonding in microelectronics packages82US 6,239,489 B1Micron Technology, Inc. · 2001
- Flip chip assembly and process with sintering material on metal bumps41US 9,117,811 B2Tessera, Inc. · 2015
- Method for fabricating stack die package23US 9,589,929 B2Vishay-Siliconix · 2017
- Solderable contact regions22US 8,975,175 B1SunPower Corporation · 2015