Semiconductor package

A semiconductor package comprising:

• a semiconductor chip, wherein the semiconductor chip comprises a gate terminal protruding from a top surface of the semiconductor chip;
• a lead frame provided on a bottom surface of the semiconductor chip and extending to one side of the semiconductor chip;
• and
• a shielding structure covering at least a portion of the top surface of the semiconductor chip,
• wherein the shielding structure comprises:
• a contact unit covering at least a portion of the top surface of the semiconductor chip;
• a protruding unit connected to the lead frame;
• and
• a connection unit connecting the contact unit and the protruding unit, and bent from the contact unit,
• wherein the contact unit surrounds at least three of sides of the gate terminal.

A semiconductor package comprising:

• a substrate comprising a wiring layer;
• a semiconductor chip disposed on a top surface of the substrate;
• a first lead and a second lead spaced apart from the semiconductor chip on the top surface of the substrate;
• and
• a shielding structure covering an entire top surface of the semiconductor chip, wherein
• each of the first lead and the second lead extends to one side of the substrate in one direction parallel to the top surface of the substrate,
• the shielding structure comprises a first bottom surface and a second bottom surface positioned at different vertical levels, wherein
• the first bottom surface covers the top surface of the semiconductor chip, and
• the second bottom surface is connected to the top surface of the semiconductor chip,
• the semiconductor chip comprises a semiconductor substrate and a drain terminal provided on a top surface of the semiconductor substrate, and
• the shielding structure electrically connects the drain terminal and the first lead.