Metal PCB for topside power delivery
AssigneeIntel Corporation
InventorsKyle Arrington, Kuang Liu, Bohan Shan, Hongxia Feng, Don Douglas Josephson, Stephen Morein, Kaladhar Radhakrishnan
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Abstract
Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, an electronic package comprises a package substrate, and a die on the package substrate. In an embodiment, the electronic package further comprises a voltage regulator on the package substrate adjacent to the die, and a metal printed circuit board (PCB) heat spreader. In an embodiment, a trace on the metal PCB heat spreader couples the die to the voltage regulator.
Claims20
An electronic package, comprising:
- a package substrate;
- a die on the package substrate;
- a voltage regulator on the package substrate, the voltage regulator laterally spaced apart from the die;
- and
- a metal printed circuit board (PCB) heat spreader, wherein a trace on the metal PCB heat spreader couples the die to the voltage regulator.
A metal PCB heat spreader, comprising:
- a metal layer;
- a dielectric layer over the metal layer;
- a first trace on a surface of the dielectric layer;
- and
- a second trace that passes through the dielectric layer and is coupled to the metal layer, the second trace and the first trace configured to couple a die and a voltage regulator, the die laterally spaced apart from the voltage regulator.
An electronic system, comprising:
- a board;
- a package substrate coupled to the board;
- a first die on the package substrate;
- a second die on the package substrate;
- a voltage regulator on the package substrate between and laterally spaced apart from the first die and the second die;
- and
- a metal printed circuit board (PCB) heat spreader, wherein a first trace on the metal PCB heat spreader couples the first die to the voltage regulator and a second trace on the metal PCB heat spreader couples the second die to the voltage regulator.
Dependencies are inferred from the claim text.