Semiconductor device

A semiconductor device comprising:

• a semiconductor chip;
• a first conductive member electrically connected to the semiconductor chip;
• a second conductive member located on a first side with respect to the semiconductor chip in a predetermined direction perpendicular to a thickness direction of the semiconductor chip;
• and
• a connection member disposed to sandwich the semiconductor chip between the connection member and the first conductive member in the thickness direction and configured to electrically connect the semiconductor chip and the second conductive member,
• wherein the semiconductor chip includes:
• a first electrode configured to form at least a part of a first surface of the semiconductor chip on a side on which the first conductive member is located in the thickness direction;
• a second electrode having a plurality of electrodes;
• and
• a partition wall having a surface that forms a part of a second surface of the semiconductor chip on a side on which the connection member is located in the thickness direction,
• each of the plurality of electrodes has a surface that forms a part of the second surface,
• the partition wall separates two of the plurality of electrodes from each other in the predetermined direction on the second surface,
• a surface of the connection member that faces a side on which the semiconductor chip is located in the thickness direction has a first portion and a second portion,
• the second portion overlaps the semiconductor chip when seen in the thickness direction and is electrically bonded to the plurality of electrodes by a bonding material,
• the first portion is arranged on the first side of the second portion,
• a portion of the partition wall that forms the second surface has a lower wettability with respect to the bonding material than portions of the plurality of electrodes that form the second surface, and
• the first portion has a lower wettability with respect to the bonding material than a wettability of the second portion with respect to the bonding material.