Semiconductor device
AssigneeRohm Co., Ltd.
InventorTakukazu Otsuka
Life of this patent
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Abstract
A semiconductor device according to the present disclosure includes a first semiconductor element; a first connecting member; and a first member. The first semiconductor element has a first element obverse surface and a first element reverse surface that face mutually opposite in a thickness direction. The first semiconductor element also has a first electrode disposed on the first element obverse surface. The first connecting member is electrically connected to the first electrode. The first member overlaps with the first electrode as viewed in the thickness direction, has a Vickers hardness lower than a Vickers hardness of the first connecting member, and has electroconductivity.
Claims15
A semiconductor device comprising:
- a first semiconductor element having a first element obverse surface and a first element reverse surface that face opposite each other in a thickness direction, the first element obverse surface being provided with a first electrode;
- a first connecting member electrically connected to the first electrode;
- a first member overlapping with the first electrode as viewed in the thickness direction, having a Vickers hardness lower than a Vickers hardness of the first connecting member, and having electrical conductivity, the first member being interposed between the first electrode and the first connecting member;
- and
- a conductive bonding layer interposed between the first member and the first electrode,
- wherein the conductive bonding layer contains a sintered metal.
Dependencies are inferred from the claim text.