H10W 72/645
Of outermost layers of multilayered strap connectors
Official title: {of outermost layers of multilayered strap connectors, e.g. coating being only on a part of a core}
H10W72/645 (Of outermost layers of multilayered strap connectors) appears on 15 US grants and 25 published applications in this corpus.
Search patents in H10W- Granted patents
- 15
- Published applications
- 25
- Assignees
- 14
- Inventors
- 64
- Latest grant
- 29 Jul 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2014 | 1 | 1 |
| 2015 | 0 | 2 |
| 2016 | 2 | 1 |
| 2017 | 0 | 3 |
| 2018 | 0 | 0 |
| 2019 | 2 | 1 |
| 2020 | 2 | 2 |
| 2021 | 1 | 6 |
| 2022 | 2 | 3 |
| 2023 | 1 | 0 |
| 2024 | 3 | 3 |
| 2025 | 1 | 2 |
| 2026 | 0 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Connecting strip for discrete and power electronic devices29 Jul 2025US 12,374,648 B2STMicroelectronics S,r.l.
- Electrical connection member, electrical connection structure, and method for manufacturing electrical connection member24 Dec 2024US 12,176,315 B2Hitachi Metals, Ltd.
- Semiconductor die being connected with a clip and a wire which is partially disposed under the clip20 Aug 2024US 12,068,274 B2Infineon Technologies AG
- Pre-plating of solder layer on solderable elements for diffusion soldering20 Aug 2024US 12,069,802 B2Infineon Technologies AG
- Semiconductor device with metal film, power conversion device with the semiconductor device, and method of manufacturing the semiconductor device17 Jan 2023US 11,557,531 B2Mitsubishi Electric Corporation
- Clip-bonded semiconductor package and corresponding method of manufacturing such a semiconductor package2 Apr 2026US 2026/0096462 A1Nexperia B. V.
- Connecting strip for discrete and power electronic devices16 Oct 2025US 2025/0323205 A1STMicroelectronics S,r.l.
- Semiconductor module and method for manufacturing semiconductor module20 Feb 2025US 2025/0062271 A1Fuji Electric Co., Ltd.
- Method for Fabricating a Semiconductor Device5 Dec 2024US 2024/0404983 A1Infineon Technologies AG
- Pre-Plating of Solder Layer on Solderable Elements for Diffusion Soldering7 Nov 2024US 2024/0373548 A1Infineon Technologies AG
Most cited
By later US patents
- Conductor strip with contact areas having cutouts4US 9,406,592 B2Continental Automotive GmbH · 2016
- Electronic device and method of manufacturing the same3US 10,373,889 B2Denso Corporation · 2019
- Half bridge circuit, method of operating a half bridge circuit and a half bridge circuit package1US 10,224,912 B2Infineon Technologies Austria AG · 2019
- Electrode terminal, semiconductor device, and power conversion apparatus1US 10,714,447 B2Mitsubishi Electric Corporation · 2020
- Nanowire interfaces1US 11,239,195 B2Texas Instruments Incorporated · 2022