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US 10,714,447 B2Granted
Electrode terminal, semiconductor device, and power conversion apparatus
AssigneeMitsubishi Electric Corporation
InventorsRei Yoneyama, Yoshitaka Kimura, Akihiko Yamashita
Life of this patent
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Abstract
An electrode terminal includes a body and a first bonding part. The body includes a first metal material. Then, the first bonding part is bonded to one end of the body, and includes a second metal material which is a clad material other than the first metal material. The first bonding part is ultrasonically bondable to a first bonded member. An elastic part which is elastically deformable is provided between the one end of the body and the other end of the body.
Claims14
An electrode terminal, comprising:
- a body composed of a single length of wire and made of only a first metal material, wherein an elastic part is provided between one end of said body and an other end of said body;
- and
- a first bonding part located on a flat surface of said one end of said body, said first bonding part composed of a second metal material other than said first metal material, the second metal material being clad directly to the first metal material with nothing in-between in cross-section, and being clad to the first metal material proximate to the first bonding part in cross-section,
- said first bonding part being ultrasonically bonded directly to a first bonded member with nothing in-between in cross-section, the first bonded member being a bondable metal disposed directly on a semiconductor chip, wherein
- said elastic part includes at least one of a notch and a plurality of discrete bends in the body, such that said elastic part produces a spring effect and thus is elastically deformable,
- a surface, which is ultrasonically bonded to said first bonded member in said first bonding part, is provided with a groove or irregularities, and
- said groove or said irregularities of said electrode terminal accommodate a protruding part provided in said first bonded member.
4 more elements
An electrode terminal, comprising:
- a body composed of a single length of wire and made of only a first metal material, wherein an elastic part is provided between one end of said body and an other end of said body;
- and
- a first bonding part located on a flat surface of said one end of said body, said first bonding part composed of a second metal material other than said first metal material, the second metal material being clad directly to the first metal material with nothing in-between in cross-section, and being clad to the first metal material proximate to the first bonding part in cross-section,
- said first bonding part being bonded to a first bonded member, the first bonded member being a bondable metal disposed directly on a semiconductor chip, wherein
- said other end of said body is bonded to a second bonded member,
- said first bonding part or said other end of said body is bonded by solder or a screw,
- said elastic part includes at least one of a notch and a plurality of discrete bends in the body, such that said elastic part produces a spring effect and thus is elastically deformable,
- a surface, which is ultrasonically bonded to said first bonded member in said first bonding part, is provided with a groove or irregularities, and
- said groove or said irregularities of said electrode terminal accommodate a protruding part provided in said first bonded member.
6 more elements
An electrode terminal, comprising:
- a body composed of a single length of wire and made of only a first metal material, wherein an elastic part, having a substantially U-shaped structure and being elastically deformable, is provided between one end of said body and an other end of said body;
- and
- a first bonding part located on a flat surface of said one end of said body, said first bonding part composed of a second metal material other than said first metal material, the second metal material being clad directly to the first metal material with nothing in-between in cross-section, and being clad to the first metal material proximate to the first bonding part in cross-section,
- said first bonding part being ultrasonically bonded directly to a main surface of a first bonded member with nothing in-between in cross-section, the first bonded member being a bondable metal disposed directly on a semiconductor chip, wherein
- a surface, which is ultrasonically bonded to said first bonded member in said first bonding part, is provided with a groove or irregularities,
- an opening of the substantially U-shaped structure is provided in a direction that is substantially parallel to the main surface of the first bonding part, and
- said groove or said irregularities of said electrode terminal accommodate a protruding part provided in said first bonded member.
4 more elements
Dependencies are inferred from the claim text.