Electronic device and method of manufacturing the same
AssigneeDenso Corporation
InventorsMasanori Ooshima, Eiji Hayashi
Life of this patent
Estimating the term…
Abstract
In an electronic device including an electronic component, a sealing resin body, a first member having at least a portion located in the sealing resin body, and a second member connected to the first member via a solder in the sealing resin body, the first member includes a base material formed of a metal material and a coated film at least on a surface of the base material which is adjacent to a back surface of the first member opposite to a facing surface of the first member facing the second member. The coated film includes a metal thin film on a surface of the base material and an uneven oxide film on the metal thin film and made of an oxide of a same metal as a main component of the metal thin film.
Claims10
An electronic device, comprising:
- an electronic component;
- a sealing resin body sealing the electronic component;
- a first member having at least a portion located in the sealing resin body;
- and
- a second member connected to the first member via a solder in the sealing resin body, wherein
- the first member has a facing surface facing the second member and a back surface opposite to the facing surface, the first member includes a base material formed of a metal material and a coated film provided at least on a surface of the base material which is adjacent to the back surface of the first member,
- the coated film includes a metal thin film provided on the surface of the base material and an uneven oxide film provided on the metal thin film and made of an oxide of a metal that is a same metal as a main component of the metal thin film, and
- the uneven oxide film is provided in the back surface of the first member so as to overlap at least an entirety of a connection region of the facing surface of the first member which is connected to the solder in a projected view along a stacking direction in which the first member, the solder, and the second member are stacked.
A method of manufacturing an electronic device, the electronic device including:
- an electronic component;
- a sealing resin body sealing the electronic component;
- a first member having at least a portion located in the sealing resin body;
- and
- a second member connected to the first member via a solder in the sealing resin body, wherein
- the first member includes a base material formed of a metal material and a coated film provided at least on a surface of the base material which is adjacent to a back surface of the first member opposite to a facing surface of the first member facing the second member,
- the coated film includes a metal thin film provided on the surface of the base material and an uneven oxide film provided on the metal thin film and made of an oxide of a metal that is a same metal as a main component of the metal thin film, and
- the uneven oxide film is provided in the back surface of the first member so as to overlap at least an entirety of a connection region of the facing surface of the first member which is connected to the solder in a projected view along a stacking direction in which the first member, the solder, and the second member are stacked,
- the method comprising:
- preparing the base material formed with the metal thin film;
- forming the uneven oxide film by irradiating a surface of the metal thin film on the back surface of the first member with a pulse oscillation laser beam, the surface of the metal think film irradiated includes at least a portion that corresponds to an entire region of the connection region;
- connecting the first member and the second member via the solder;
- after the forming of the uneven oxide film and the connecting of the first member and the second member, molding the sealing resin body;
- and,
- after the molding of the sealing resin body, inspecting the solder from a side adjacent to the first member in the stacking direction using a supersonic flaw detector.
Dependencies are inferred from the claim text.