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US 9,406,592 B2Granted
Conductor strip with contact areas having cutouts
AssigneeContinental Automotive GmbH
InventorsNico Kohl, Martin Metzler, Sven Egelkraut, Markus Leicht
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Abstract
A power semiconductor circuit includes at least one semiconductor having at least one contact area, and at least one bonding conductor strip having at least one contact region fastened on at least one of the contact areas. The contact region of the bonding conductor strip includes cutouts.
Claims18
A power semiconductor circuit comprising:
- at least one semiconductor having at least one contact area;
- at least one bonding conductor strip comprising at least one contact region fastened on at least one of the contact areas;
- and
- an array of cutouts in the at least one contact region of the at least one bonding conductor strip;
- wherein the array of cutouts is distributed at a first uniform density in a center area of the at least one contact region and at a second uniform density outside of the center area;
- and
- wherein the first uniform density is lower than the second uniform density.
4 more elements
A method for producing a power semiconductor circuit comprising:
- producing an array of cutouts in a region of a bonding conductor strip;
- wherein the array of cutouts is distributed at a first uniform density in a center area of the at least one contact region and at a second uniform density outside of the center area;
- wherein the first uniform density is lower than the second uniform density;
- and
- fastening the region of the bonding conductor strip in which the cutouts have been produced, as a contact region, on a contact area of a semiconductor or on a contact section of a conductor track.
2 more elements
Dependencies are inferred from the claim text.