Method for Fabricating a Semiconductor Device
AssigneeInfineon Technologies AG
InventorMark Pavier
Life of this patent
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Abstract
A method for fabricating a semiconductor device includes: providing a carrier; providing first and second external contacts; providing a semiconductor die including a first main face, a second main face opposite to the first main face, a first contact pad disposed on the first main face, a second contact pad disposed on the second main face, and a vertical transistor; disposing the semiconductor die with the first main face onto the carrier; connecting a wire with the second external contact; and connecting a clip between the second contact pad and the first external contact. Connecting the wire is carried out before connecting the clip.
Claims20
A method for fabricating a semiconductor device, the method comprising:
- providing a carrier;
- providing first and second external contacts;
- providing a semiconductor die comprising a first main face, a second main face opposite to the first main face, a first contact pad disposed on the first main face, a second contact pad disposed on the second main face, and a vertical transistor;
- disposing the semiconductor die with the first main face onto the carrier;
- connecting a first wire with the second external contact;
- and
- connecting a clip between the second contact pad and the first external contact,
- wherein connecting the first wire is carried out before connecting the clip.
Dependencies are inferred from the claim text.