H10W 72/644
Connecting directly between multiple pads on a chip
Official title: {connecting directly between multiple pads on a chip}
H10W72/644 (Connecting directly between multiple pads on a chip) appears on 15 US grants and 22 published applications in this corpus.
Search patents in H10W- Granted patents
- 15
- Published applications
- 22
- Assignees
- 16
- Inventors
- 49
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2012 | 0 | 1 |
| 2013 | 0 | 1 |
| 2014 | 0 | 0 |
| 2015 | 2 | 3 |
| 2016 | 0 | 0 |
| 2017 | 0 | 2 |
| 2018 | 2 | 1 |
| 2019 | 2 | 2 |
| 2020 | 2 | 3 |
| 2021 | 3 | 3 |
| 2022 | 0 | 0 |
| 2023 | 2 | 2 |
| 2024 | 0 | 1 |
| 2025 | 0 | 1 |
| 2026 | 2 | 2 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Sensor packages11 Aug 2026US 12,708,034 B2Texas Instruments Incorporated
- Module with gas flow-inhibiting sealing at module interface to mounting base6 Jan 2026US 12,519,023 B2Infineon Technologies AG
- Module with gas flow-inhibiting sealing at module interface to mounting base28 Mar 2023US 11,615,994 B2Infineon Technologies AG
- Semiconductor device with metal film, power conversion device with the semiconductor device, and method of manufacturing the semiconductor device17 Jan 2023US 11,557,531 B2Mitsubishi Electric Corporation
- Semiconductor device17 Aug 2021US 11,094,638 B2Fuji Electric Co., Ltd.
- Semiconductor device and vehicle19 Mar 2026US 2026/0082945 A1Rohm Co., Ltd.
- Electrostatic discharge protection device5 Mar 2026US 2026/0068326 A1STMicroelectronics International N. V.
- Sensor packages4 Sep 2025US 2025/0279323 A1Texas Instruments Incorporated
- Semiconductor Package Providing an Even Current Distribution and Stray Inductance Reduction and a Semiconductor Device Module23 May 2024US 2024/0170377 A1Infineon Technologies Austria AG
- Module with Gas Flow-Inhibiting Sealing at Module Interface to Mounting Base22 Jun 2023US 2023/0197542 A1Infineon Technologies AG
Most cited
By later US patents
- HBT cascode cell4US 9,105,604 B2Teledyne Scientific & Imaging, LLC · 2015
- Stray inductance reduction in packaged semiconductor devices3US 11,031,379 B2Semiconductor Components Industries, LLC · 2021
- Semiconductor device2US 11,094,638 B2Fuji Electric Co., Ltd. · 2021
- Semiconductor device and method of manufacturing the same1US 10,515,877 B2Renesas Electronics Corporation · 2019
- Package comprising chip contact element of two different electrically conductive materials1US 11,056,458 B2Infineon Technologies AG · 2021