Package comprising chip contact element of two different electrically conductive materials

A package, comprising:

• an electronic chip having at least one pad;
• an encapsulant at least partially encapsulating the electronic chip;
• an electrically conductive contact element extending from the at least one pad and through the encapsulant so as to be exposed with respect to the encapsulant;
• wherein the electrically conductive contact element comprises a first contact structure made of a first electrically conductive material on the at least one pad and comprises a second contact structure made of a second electrically conductive material and being exposed with respect to the encapsulant;
• wherein at least one of the at least one pad has at least a surface portion which comprises or is made of the first electrically conductive material;
• comprising a chip carrier on which the electronic chip is mounted;
• and
• comprising at least one electrically conductive protrusion protruding from the chip carrier, in particular up to a vertical level up to which the contact element extends.

A package, comprising:

• an at least partially electrically conductive chip carrier;
• an electronic chip mounted on the chip carrier, wherein the electronic chip is provided with a pad having an exterior surface comprising a first metal;
• an electrically conductive contact element extending from the pad;
• an encapsulant at least partially encapsulating the contact element and the electronic chip;
• and
• wherein the contact element comprises:
• a first contact structure on the at least one pad and being disposed entirely below an upper surface of the encapsulant;
• and
• a second contact structure being disposed at least partially below the upper surface of the encapsulant and comprising an exposed surface being not covered by the encapsulant,
• the first contact structure comprising the first metal and the second contact structure comprising a second metal.

A method of manufacturing a package, wherein the method comprises:

• at least partially encapsulating an electronic chip, having at least one pad, by an encapsulant;
• providing an electrically conductive contact element extending from the at least one pad and through the encapsulant so as to be exposed with respect to the encapsulant;
• configuring the electrically conductive contact element to comprise a first contact structure made of a first electrically conductive material on the at least one pad, the first contact structure disposed entirely below an upper surface of the encapsulant, and to comprise a second contact structure made of a second electrically conductive material, the second contact structure disposed at least partial below the upper surface of the encapsulant and being exposed with respect to the encapsulant,
• wherein at least one of the at least one pad has at least a surface portion which comprises or is made of the first electrically conductive material.

A method of manufacturing a package, wherein the method comprises:

• at least partially encapsulating an electronic chip, having at least one pad, by an encapsulant;
• providing an electrically conductive contact element extending from the at least one pad and through the encapsulant so as to be exposed with respect to the encapsulant;
• configuring the electrically conductive contact element to comprise a first contact structure made of a first electrically conductive material on the at least one pad and to comprise a second contact structure made of a second electrically conductive material, and being exposed with respect to the encapsulant,
• wherein at least one of the at least one pad has at least a surface portion which comprises or is made of the first electrically conductive material;
• wherein the method comprises attaching the electrically conductive contact element to the at least one pad before the encapsulating;
• and
• wherein the electrically conductive contact element is a strip element comprising the first contact structure having a first layer made of the first electrically conductive material and the second contact structure having a second layer made of the second electrically conductive material.