Semiconductor device and method of manufacturing the same
AssigneeRenesas Electronics Corporation
InventorsYukihiro Sato, Toshinori Kiyohara
Life of this patent
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Abstract
A performance of a semiconductor device is improved. The semiconductor device according to one embodiment includes a wire bonded to one bonding surface at a plurality of parts in an opening formed in an insulating film of a semiconductor chip. The semiconductor device includes also a sealer that seals the semiconductor chip and the wire so that the sealer is in contact with the bonding surface. The bonding surface includes a first region to which a bonding portion of the wire is bonded, a second region to which another bonding portion of the wire is bonded, and a third region between the first region and the second region. A width of the third region is smaller than a width of the first region and a width of the second region.
Claims16
A semiconductor device comprising:
- a semiconductor chip having an electrode pad including a first bonding surface and having an insulating film including a first opening that exposes the first bonding surface of the electrode pad;
- a first wire bonded to the first bonding surface of the electrode pad;
- and
- a sealer sealing the semiconductor chip and the first wire so that the sealer is in contact with the first bonding surface of the electrode pad,
- wherein the first bonding surface is made of metal,
- the sealer is made of an insulating material,
- the first bonding surface includes, in a plan view,
- a first region;
- a second region;
- and
- a third region between the first region and the second region,
- the first wire includes:
- a first bonding portion bonded to the first region of the first bonding surface;
- a second bonding portion bonded to the second region of the first bonding surface;
- and
- a first middle portion located between the first bonding portion and the second bonding portion,
- in a plan view, the first middle portion extends in a first direction, and the first middle portion and the third region are separated from each other, and,
- in a plan view, each of a width of the first region in a second direction orthogonal to the first direction and a width of the second region in the second direction is larger than a width of the third region in the second direction.
A semiconductor device comprising:
- a semiconductor chip having an electrode pad including a first bonding surface and having an insulating film including a first opening exposing the first bonding surface of the electrode pad;
- a first wire bonded to the first bonding surface of the electrode pad;
- and
- a sealer sealing the semiconductor chip and the first wire so that the sealer is in contact with the first bonding surface of the electrode pad,
- wherein the first bonding surface is made of metal,
- the sealer is made of an insulating material,
- the first wire includes:
- a first bonding portion bonded to the first bonding surface;
- a second bonding portion bonded to the first bonding surface;
- and
- a first middle portion located between the first bonding portion and the second bonding portion,
- in a plan view, the first middle portion extends in a first direction, and the first middle portion and the first bonding surface are separated from each other,
- the first opening includes, in a plan view,
- a first side extending in the first direction;
- a second side opposite to the first side;
- a third side extending in a second direction orthogonal to the first direction;
- and
- a fourth side opposite to the third side,
- the first side includes, in a plan view,
- a first portion extending in the first direction;
- a second portion extending in the first direction;
- and
- a third portion located between the first portion and the second portion and extending in the first direction, and,
- in the second direction in a plan view, the first bonding portion is located between the first portion of the first side and the second side,
- in the second direction in a plan view, the second bonding portion is located between the second portion of the first side and the second side,
- in the second direction in a plan view, the first middle portion is located between the third portion of the first side and the second side, and,
- in a plan view, each of a length in the second direction from the first portion of the first side to the second side and a length in the second direction from the second portion of the first side to the second side is larger than a length in the second direction from the third portion to the second side.
Dependencies are inferred from the claim text.