Module with gas flow-inhibiting sealing at module interface to mounting base
AssigneeInfineon Technologies AG
InventorsJohannes Uhlig, Sven Hagebusch, Marco Ludwig, Ulrich Nolten
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Abstract
A module includes an electronic component, an enclosure at least partially enclosing the electronic component and defining a module interface at which the module is configured to be mounted on a mounting base, and a gas flow-inhibiting sealing at the module interface and configured to inhibit gas from propagating from an exterior of the module towards the electronic component. An electronic device that includes the module and a method of manufacturing the module are also described.
Claims16
A module, comprising:
- an electronic component;
- an enclosure at least partially enclosing the electronic component and defining a module interface at which the module is configured to be mounted on a mounting base;
- and
- a gas flow-inhibiting sealing at the module interface and configured to inhibit gas from propagating from an exterior of the module towards the electronic component,
- wherein the gas flow-inhibiting sealing is made of a compressible material.
A module, comprising:
- an electronic component;
- an enclosure at least partially enclosing the electronic component and defining a module interface at which the module is configured to be mounted on a mounting base;
- and
- a gas flow-inhibiting sealing at the module interface and configured to inhibit gas from propagating from an exterior of the module towards the electronic component,
- wherein the gas flow-inhibiting sealing is made of an elastic material.
A module, comprising:
- an electronic component;
- an enclosure at least partially enclosing the electronic component and defining a module interface at which the module is configured to be mounted on a mounting base;
- a gas flow-inhibiting sealing at the module interface and configured to inhibit gas from propagating from an exterior of the module towards the electronic component;
- a carrier that carries the electronic component;
- and
- a further gas flow-inhibiting sealing between the carrier and the enclosure.
A module, comprising:
- an electronic component;
- an enclosure at least partially enclosing the electronic component and defining a module interface at which the module is configured to be mounted on a mounting base;
- and
- a gas flow-inhibiting sealing at the module interface and configured to inhibit gas from propagating from an exterior of the module towards the electronic component,
- wherein at least one of:
- the gas flow-inhibiting sealing comprises a gas-diffusion inhibiting material;
- the gas flow-inhibiting sealing comprises sacrificial particles configured to consume corrosive gas;
- the electronic component has at least one pad made of a corrodible material being corrodible by the corrosive gas;
- electrically conductive needles electrically couple the electronic component with an exterior of the module;
- and
- the electronic component is a power semiconductor chip.
A module, comprising:
- an electronic component;
- an enclosure at least partially enclosing the electronic component and defining a module interface at which the module is configured to be mounted on a mounting base;
- and
- a gas flow-inhibiting sealing at the module interface and configured to inhibit gas from propagating from an exterior of the module towards the electronic component,
- wherein the gas flow-inhibiting sealing is a gas flow-tight sealing.
Dependencies are inferred from the claim text.