H10W 72/327
Multiple die-attach connectors having different sizes
Official title: {Multiple die-attach connectors having different sizes}
H10W72/327 (Multiple die-attach connectors having different sizes) appears on 241 US grants and 319 published applications in this corpus.
Search patents in H10W- Granted patents
- 241
- Published applications
- 319
- Assignees
- 120
- Inventors
- 678
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 1 |
| 2002 | 0 | 1 |
| 2003 | 1 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 3 |
| 2006 | 0 | 0 |
| 2007 | 2 | 1 |
| 2008 | 0 | 5 |
| 2009 | 0 | 1 |
| 2010 | 1 | 3 |
| 2011 | 3 | 1 |
| 2012 | 3 | 5 |
| 2013 | 7 | 6 |
| 2014 | 5 | 16 |
| 2015 | 13 | 11 |
| 2016 | 12 | 13 |
| 2017 | 16 | 13 |
| 2018 | 11 | 20 |
| 2019 | 20 | 17 |
| 2020 | 25 | 29 |
| 2021 | 11 | 23 |
| 2022 | 17 | 31 |
| 2023 | 19 | 38 |
| 2024 | 20 | 42 |
| 2025 | 30 | 24 |
| 2026 | 24 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Semiconductor device having chip capacitor connected to semiconductor chip with wires8 Sep 2026US 12,733,183 B2Renesas Electronics Corporation
- Package structure and method for manufacturing the same25 Aug 2026US 12,721,198 B2Nanya Technology Corporation
- Bump-on-trace design for enlarge bump-to-trace distance25 Aug 2026US 12,721,206 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Packaging module and electronic device25 Aug 2026US 12,721,226 B2Huawei Technologies Co., Ltd.
- Hybrid Underfill Structures for Multi-Die Packages and Methods of Forming the Same1 Oct 2026US 2026/0305473 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package17 Sep 2026US 2026/0283036 A1Samsung Electronics Co., Ltd.
- Semiconductor memory and manufacturing method thereof27 Aug 2026US 2026/0256025 A1Kioxia Corporation
- Semiconductor package and method of manufacturing the same18 Jun 2026US 2026/0173874 A1Samsung Electronics Co., Ltd.
- Power module18 Jun 2026US 2026/0173915 A1Advanced Semiconductor Engineering, Inc.
Most cited
By later US patents
- Chemical mechanical polishing for hybrid bonding165US 10,840,205 B2Invensas Bonding Technologies, Inc. · 2020
- Semiconductor device and a method of manufacturing the same74US 6,552,421 B2Hitachi, Ltd. · 2003
- Semiconductor device and method61US 10,340,249 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2019
- Multiple bond via arrays of different wire heights on a same substrate61US 9,263,394 B2Invensas Corporation · 2016
- Flip-chip light emitting diode device without sub-mount58US 7,179,670 B2GELcore, LLC · 2007